Means and methods for heating semiconductor ribbons and wafers with
microwvaes
    11.
    发明授权
    Means and methods for heating semiconductor ribbons and wafers with microwvaes 失效
    用微波加热半导体带和晶圆的方法和方法

    公开(公告)号:US4714810A

    公开(公告)日:1987-12-22

    申请号:US890406

    申请日:1986-07-28

    Inventor: Murray D. Sirkis

    CPC classification number: H05B6/686 H05B6/705 H05B6/707 H05B6/806

    Abstract: Means and method including a novel waveguide sample holder for applying traveling microwaves to heat thin low-resistivity semiconductor ribbons and wafers without a susceptor. Traveling microwaves are applied to the semiconductor materials, both with and without a traveling wave resonator. Efficient coupling is obtained by unique placement of the samples in the waveguide.

    Abstract translation: 包括用于施加行进微波以加热薄的低电阻率半导体带和晶片而没有基座的新型波导样品保持器的方法和方法。 移动微波应用于具有和不具有行波谐振器的半导体材料。 通过在波导中独特地放置样品来获得有效的耦合。

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