公开(公告)号：US20180301605A1

公开(公告)日：2018-10-18

申请号：US15559684

申请日：2015-03-19

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Sok Gek Beh ,  Eng Suan Neoh ,  Sung Ern Kow

IPC: H01L33/58

Abstract: A window that covers an optoelectronic semiconductor chip includes an upper face, the upper face including a polygonal shape, wherein at least one corner of the upper face is chamfered. A method of producing a window that covers an optoelectronic semiconductor chip, the method including providing a panel; creating a plurality of holes at an upper face of the panel; dividing the panel along separation lines to obtain a plurality of windows, wherein the separation lines extend through the holes.