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    Optoelectronic device
    1.
    发明授权
    Optoelectronic device 有权

    公开(公告)号：US09627590B2

    公开(公告)日：2017-04-18

    申请号：US14908650

    申请日：2013-07-30

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Jason Rajakumaran Rajasegaran ,  Sok Gek Beh

    IPC: H01L33/00 ,  H01L33/48 ,  H01L33/60 ,  H01L33/62

    CPC classification number: H01L33/483 ,  H01L33/60 ,  H01L33/62 ,  H01L2933/0033 ,  H01L2933/0058 ,  H01L2933/0066

    Abstract: An optoelectronic device includes a carrier, a housing, and a radiation source that emits electromagnetic radiation arranged on the carrier, wherein the housing is fixed to the carrier by a glue layer, the glue layer is arranged between a first face of the housing and a second face of the carrier, the first face of the housing and the second face of the carrier are arranged at an inclination angle to each other, a distance between the first face and the second face increases from an outer rim in a direction to a middle area of the carrier, and a thickness of the glue layer increases at least partially from the outer rim in the direction to the middle area of the carrier.

    Optoelectronic Semiconductor Device and Method for Producing an Optoelectronic Semiconductor Device
    3.
    发明申请
    Optoelectronic Semiconductor Device and Method for Producing an Optoelectronic Semiconductor Device 有权

    公开(公告)号：US20210050493A1

    公开(公告)日：2021-02-18

    申请号：US16979677

    申请日：2018-03-12

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Jun Jun Lim ,  Sok Gek Beh ,  Mohd Fauzi Zainordin ,  Purusothaman Supramaniam

    IPC: H01L33/58 ,  H01L33/48 ,  H01S5/022 ,  H01S5/02

    Abstract: An optoelectronic semiconductor device and a method for producing an optoelectronic semiconductor device are disclosed. In an embodiment an optoelectronic semiconductor device includes a carrier having at least two electrically conductive components connected by an electrically insulating material, an optoelectronic semiconductor chip fixed to the carrier at a top side of the carrier, the optoelectronic semiconductor chip configured to emit electromagnetic radiation, a total internal reflection lens and a housing surrounding the total internal reflection lens laterally, wherein the electrically insulating material does not protrude over the electrically conductive components at the top side of the carrier, wherein the housing and the total internal reflection lens are arranged at a radiation exit side of the optoelectronic semiconductor chip, and wherein the total internal reflection lens does not protrude over the housing at an upper side of the optoelectronic semiconductor device, the upper side facing away from the carrier.

    Optoelectronic Component
    4.
    发明申请
    Optoelectronic Component 审中-公开

    公开(公告)号：US20200235269A1

    公开(公告)日：2020-07-23

    申请号：US16647782

    申请日：2018-04-10

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Mohd Fauzi Zainordin ,  Khairul Mohd Arshad ,  Sok Gek Beh ,  Jun Jun Lim

    IPC: H01L33/58 ,  H01L33/48 ,  H01L33/60 ,  H01L33/62

    Abstract: An optoelectronic component is disclosed. In an embodiment an optoelectronic component includes a housing body, an optical element and a rabbet comprising a shoulder and a cheek, wherein the rabbet is located on an upper side of the housing body, wherein the optical element is located in the rabbet such that a brim of the optical element rests on the shoulder of the rabbet, wherein the upper side of the housing body comprises a rectangular shape, and wherein the shoulder of the rabbet is located only at corners of the rabbet.

    Leadframe and chip package comprising a leadframe
    5.
    发明授权
    Leadframe and chip package comprising a leadframe 有权

    公开(公告)号：US10109562B2

    公开(公告)日：2018-10-23

    申请号：US15547703

    申请日：2015-02-06

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Sok Gek Beh ,  Mei See Boon ,  Wing Yew Wong ,  Hui Ying Pee

    IPC: H01L23/495 ,  H01L21/00

    Abstract: A leadframe includes first and second parts separated from each other, and each comprises at least one anchoring hole. The first part comprises a mounting area, the second part comprises an edge line facing the first part which is curved, and the first part comprises first, second and third portions each having a maximum width, wherein the mounting area is arranged at the third portion, and the third portion follows the second portion and the second portion follows the first portion in a direction of a longitudinal extent of the first part such that the third portion faces the second part.

    OPTOELECTRONIC DEVICE
    7.
    发明申请
    OPTOELECTRONIC DEVICE 有权
    光电器件

    公开(公告)号：US20160211421A1

    公开(公告)日：2016-07-21

    申请号：US14908650

    申请日：2013-07-30

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

    Inventor： Jason Rajakumaran Rajasegaran ,  Sok Gek Beh

    IPC: H01L33/48 ,  H01L33/60 ,  H01L33/62

    CPC classification number: H01L33/483 ,  H01L33/60 ,  H01L33/62 ,  H01L2933/0033 ,  H01L2933/0058 ,  H01L2933/0066

    Abstract: An optoelectronic device includes a carrier, a housing, and a radiation source that emits electromagnetic radiation arranged on the carrier, wherein the housing is fixed to the carrier by a glue layer, the glue layer is arranged between a first face of the housing and a second face of the carrier, the first face of the housing and the second face of the carrier are arranged at an inclination angle to each other, a distance between the first face and the second face increases from an outer rim in a direction to a middle area of the carrier, and a thickness of the glue layer increases at least partially from the outer rim in the direction to the middle area of the carrier.

    Abstract translation: 光电子器件包括载体，外壳和发射布置在载体上的电磁辐射的辐射源，其中壳体通过胶层固定到载体上，胶层布置在壳体的第一面和 载体的第二面，壳体的第一面和载体的第二面以相互倾斜的角度布置，第一面和第二面之间的距离从外边缘朝向中间的方向增加 载体的面积，并且胶层的厚度至少部分地从载体的方向上的外缘增加到中间区域。

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