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公开(公告)号:US10313444B2
公开(公告)日:2019-06-04
申请号:US15449717
申请日:2017-03-03
Inventor: Takeshi Takahashi
IPC: H04L29/08 , H04L12/403
Abstract: In a case of a connection destination of a master device in wireless communication not being registered in the master device, a smartphone, at the start of setting of the registration, determines a mode of wireless communication with the master device (specifically, a router connection mode or a soft AP mode) according to whether or not wireless communication is performed through a wireless router and acquires setting information related to the connection destination corresponding to the determined mode of wireless communication. The smartphone sends a message indicating that wireless communication will be performed in the determined mode of wireless communication and sends the setting information related to the connection destination corresponding to the mode of wireless communication to the master device. The master device registers the setting information that is sent from the smartphone and related to the connection destination corresponding to the mode of wireless communication.
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公开(公告)号:US09881722B2
公开(公告)日:2018-01-30
申请号:US14436878
申请日:2013-10-25
Inventor: Shota Nishio , Takeshi Takahashi
IPC: H01F3/08 , H01F1/08 , B22F3/26 , H01F1/26 , H01F41/02 , B22F3/12 , H01F41/00 , C22C33/02 , B22F3/24 , B22F1/00 , B22F3/02
CPC classification number: H01F3/08 , B22F1/0011 , B22F3/12 , B22F3/26 , B22F2003/023 , B22F2003/248 , B22F2998/10 , C22C33/02 , C22C2202/02 , H01F1/08 , H01F1/26 , H01F41/005 , H01F41/0246 , H01F41/0266 , B22F1/0003 , B22F2001/0066 , B22F3/02 , B22F3/1021
Abstract: A composite magnetic body includes metal magnetic powder formed of metal magnetic particles and an insulator impregnated into at least a part of voids among the metal magnetic particles. On a cumulative curve of widths of the voids among the metal magnetic particles, a void width at which a cumulative distribution is 50% is equal to or smaller than 3 μm, and a void width at which the cumulative distribution is 95% is equal to or greater than 4 μm.
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