公开(公告)号：US20210274684A1

公开(公告)日：2021-09-02

申请号：US16876342

申请日：2020-05-18

Applicant: Quanta Computer Inc.

Inventor： Hsiao-Tsu NI ,  Chun CHANG ,  Hsin-Chieh LIN ,  Chia-Jung TSAI

IPC: H05K7/20 ,  F28F13/06

Abstract: An air baffle for optimizing thermal performance of memory components provided in a chassis is disclosed. The air baffle has a body and one or more venting units provided on the body. The body is configured to be removably coupled to the chassis. The body covers the memory components when coupled to the chassis. The one or more venting units direct air flowing through the chassis. Each of the venting units includes vent openings and a corresponding number of adjustable venting plates. The vent openings are each aligned with the memory components when the body is coupled to the chassis. Each of the adjustable venting plates have an open position or a closed position. A respective venting plate of the adjustable venting plates in the open position allows airflow through a respective vent opening of the vent openings. The respective venting plate of the adjustable venting plates in the closed position blocks airflow through the respective vent opening of the vent openings.

公开(公告)号：US20200096003A1

公开(公告)日：2020-03-26

申请号：US16138210

申请日：2018-09-21

Applicant: QUANTA COMPUTER INC.

Inventor： Yaw-Tzorng TSORNG ,  Chun CHANG ,  Hsin-Chieh LIN

IPC: F04D29/00 ,  F04D29/70 ,  F04D29/40

Abstract: An apparatus includes a fan module and an elongated lens. The fan module includes a housing and a cover plate having a plurality of apertures. The elongated lens includes a head portion that extends through one of the apertures of the cover plate. The head portion has a first dimension and a second dimension. The aperture also has a first dimension and a second dimension. The first dimension of the head portion is less than the first dimension of the aperture and is greater than the second dimension of the aperture. When the first dimension of the head portion is aligned with the first dimension of the aperture, the aperture permits the head portion to pass through the aperture. When the first dimension of the head portion is aligned with the second dimension of the aperture, the aperture prevents the head portion from passing through the aperture.

公开(公告)号：US20200084919A1

公开(公告)日：2020-03-12

申请号：US16124345

申请日：2018-09-07

Applicant: QUANTA COMPUTER INC.

Inventor： Chiao-Lun TSAI ,  Hsin-Chieh LIN ,  Che-Wei HSU

IPC: H05K7/20 ,  G06F1/20 ,  H05K7/14 ,  H01R12/73

Abstract: A computing device for cooling an electronic component is provided. The computing device includes a chassis with a first end and a second end; fan modules located at the first end of the chassis; and a Peripheral Component Interconnect Express (PCIe) baseboard located at a front side of the chassis. The PCIe baseboard is configured to support placement thereof in the chassis in a first position and a second position. The second position of the PCIe baseboard is a 180-degree rotation from the first position. The PCIe baseboard includes GPU slots for installing a plurality of graphic processing units (GPUs), the GPUs including fan modules.