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公开(公告)号:US20200077543A1
公开(公告)日:2020-03-05
申请号:US16246050
申请日:2019-01-11
Applicant: QUANTA COMPUTER INC.
Inventor: Chao-Jung CHEN , Yu-Nien HUANG , Ching-Yu CHEN , Kuo-Wei LEE
Abstract: A server includes an inner housing disposed within an outer housing such that a channel is defined between them. The inner housing includes a low-power electronic component and a high-power electronic component, and is sealed to protect the components. A first heat sink extends through the inner housing. Heat generated by the low-power electronic component is transferred through an inner portion of the first heat sink to an outer portion of the first heat sink. A second heat sink disposed in the channel is coupled to the high-power electronic component via heat pipes that extend through the inner housing. Heat generated by the high-power electronic component is transferred through the heat pipes to the second heat sink. A fan positioned in the channel causes air to enter the channel through a first vent, flow through the channel, and exit the channel via a second vent to remove the generated heat.
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公开(公告)号:US20190296486A1
公开(公告)日:2019-09-26
申请号:US16058408
申请日:2018-08-08
Applicant: QUANTA COMPUTER INC.
Inventor: Chao-Jung CHEN , Yu-Nien HUANG , Kuen-Hsien WU , Kuo-Wei LEE
IPC: H01R13/631 , H05K7/20 , H01R13/502
Abstract: A heat transfer system between a heat source and a heat sink, wherein the heat transfer contact surfaces comprise a metal which forms numerous voids when placed adjacent one another. A thermal pad comprising a polymer filled with ceramic particles is placed between these heat transfer surfaces to intimately contact each of the metal surfaces without void formation, thereby increasing thermal conductivity. The heat source and heat sink are joined by relative sliding motion. This sliding motion might damage the thermal pad. Thus, a hot swap structure is provided for controlling the movement of the thermal pad into contact with the heat source as the sliding motion is completed.
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