公开(公告)号：US20190025529A1

公开(公告)日：2019-01-24

申请号：US15876572

申请日：2018-01-22

Applicant: QUANTA COMPUTER INC.

Inventor： Chao-Jung CHEN ,  Yu-Nien HUANG ,  Kuen-Hsien WU ,  Kuo-Wei LEE

IPC: G02B6/42

Abstract: A transceiver cage and heat sink assembly for an optical switch is disclosed. A transceiver cage has an open front end to receive an optical transceiver and an opposite rear end. A front heat sink is mounted over the transceiver cage that includes a thermal interface material to contact a contact surface of an optical transceiver. A printed circuit board has a connector electronic circuit to receive a connector on the optical transceiver. A rear heat sink has a beveled surface facing the rear end of the transceiver cage. A cam structure in the front heat sink forces the transceiver into contact with the front heat sink. A metal foil layer is coated on the thermal interface material.

公开(公告)号：US20180376617A1

公开(公告)日：2018-12-27

申请号：US15783043

申请日：2017-10-13

Applicant: QUANTA COMPUTER INC.

Inventor： Chao-Jung CHEN ,  Yu-Nien HUANG ,  Kuen-Hsien WU ,  Kuo-Wei LEE

IPC: H05K7/20

CPC classification number: H05K7/20336 ,  G02B6/4269 ,  H05K7/20272 ,  H05K7/20781 ,  H05K7/20809 ,  H05K7/20818

Abstract: A heat dissipating apparatus for cooling a transceiver is provided. The apparatus includes a cooling jacket configured to receive the transceiver. The transceiver is secured within the cooling jacket via a connecting structure. The apparatus also includes cooling devices secured to an exterior surface of the cooling jacket, the plurality of cooling devices comprising a highly thermal conductivity material. The apparatus also includes a heat dissipation device connected to a distal end of each of the plurality of cooling devices.

公开(公告)号：US20200303283A1

公开(公告)日：2020-09-24

申请号：US16358250

申请日：2019-03-19

Applicant: QUANTA COMPUTER INC.

Inventor： Chao-Jung CHEN ,  Yu-Nien HUANG ,  Kuen-Hsien WU ,  Shih-I LIANG

IPC: H01L23/40 ,  H01L23/427 ,  F28D15/02 ,  F28F3/00

Abstract: A heat sink having a flexible heat sink base is disclosed in order to flex the heat sink into contact with concave heat sources. Flexibility is achieved by providing a series of concentric grooves on the heat sink base on a surface opposite the surface contacting the heat source. A central cylinder is provided at the center of the concentric grooves. A biasing device, such as a spring, exerts a force on the central cylinder to flex the heat sink base.

公开(公告)号：US20190024675A1

公开(公告)日：2019-01-24

申请号：US15935853

申请日：2018-03-26

Applicant: QUANTA COMPUTER INC.

Inventor： Chao-Jung CHEN ,  Yu-Nien HUANG ,  Kuen-Hsien WU ,  Kuo-Wei LEE

IPC: F04D29/54 ,  F04D25/08 ,  H05K7/20

Abstract: A cooling system for providing streamlined airflow is provided. The system includes a fan with a plurality of fan blades configured to rotate in a fan direction. The system also includes a shroud component abutting the fan upstream. The shroud component includes a plurality of blade farings, a spinner faring, and optionally a strut interconnecting each of the plurality of blade farings.

公开(公告)号：US20190296486A1

公开(公告)日：2019-09-26

申请号：US16058408

申请日：2018-08-08

Applicant: QUANTA COMPUTER INC.

Inventor： Chao-Jung CHEN ,  Yu-Nien HUANG ,  Kuen-Hsien WU ,  Kuo-Wei LEE

IPC: H01R13/631 ,  H05K7/20 ,  H01R13/502

Abstract: A heat transfer system between a heat source and a heat sink, wherein the heat transfer contact surfaces comprise a metal which forms numerous voids when placed adjacent one another. A thermal pad comprising a polymer filled with ceramic particles is placed between these heat transfer surfaces to intimately contact each of the metal surfaces without void formation, thereby increasing thermal conductivity. The heat source and heat sink are joined by relative sliding motion. This sliding motion might damage the thermal pad. Thus, a hot swap structure is provided for controlling the movement of the thermal pad into contact with the heat source as the sliding motion is completed.

公开(公告)号：US20190234647A1

公开(公告)日：2019-08-01

申请号：US15972795

申请日：2018-05-07

Applicant: QUANTA COMPUTER INC.

Inventor： Chao-Jung CHEN ,  Yu-Nien HUANG ,  Kuen-Hsien WU

IPC: F24F13/14

CPC classification number: F24F13/1426 ,  F04D19/007 ,  F04D25/08 ,  F04D25/14 ,  F04D25/166 ,  F04D29/601

Abstract: A fan assembly is disclosed to prevent reverse air flow when the fan stops working. The assembly has a fan module including an intake end, a motor casing and a motor propelling a fan. A louver module has a plurality of slats having an open position to allow air flow and a closed position to block air flow. The louver module is coupled to the motor casing to provide a seal between the louver module and the motor casing.