公开(公告)号：US10952354B1

公开(公告)日：2021-03-16

申请号：US16752100

申请日：2020-01-24

Applicant: Quanta Computer Inc.

Inventor： Chao-Jung Chen ,  Yu-Nien Huang ,  Tsung-Ta Li ,  Kuo-Wei Lee

IPC: H05K7/20 ,  H01L23/473 ,  F16L19/02 ,  H01L23/46 ,  G06F1/20 ,  F16L19/04

Abstract: A cold plate assembly for cooling heat-generating electrical component on a circuit board is disclosed. The cold plate assembly includes a cold plate with a bottom contact surface to thermally contact the heat-generating electrical component. The cold plate has an inlet coupler on an opposite top surface to receive coolant; an internal conduit to circulate the received coolant; and an outlet coupler on the opposite top surface to return the coolant. A flexible metal inlet tube is fluidly connected to the inlet coupler to supply coolant. A flexible metal outlet tube is fluidly connected to the outlet coupler to return coolant.