公开(公告)号：US20210360772A1

公开(公告)日：2021-11-18

申请号：US16874794

申请日：2020-05-15

Applicant: Raytheon Company

Inventor： Thomas V. Sikina ,  John P. Haven ,  James E. Benedict ,  William J. Clark ,  Channing P. Favreau ,  Erika Klek ,  Mikhail Pevzner ,  Donald G. Hersey ,  Gregory G. Beninati ,  Thomas J. Tellinghuisen

IPC: H05K1/02 ,  H05K7/14 ,  H01P1/20

Abstract: Methods and apparatus for providing a cavity defined by conductive walls, a printed circuit board (PCB) within the cavity, and shorting posts extending into the cavity to suppress higher order modes generated by operation of the PCB.

公开(公告)号：US20170178996A1

公开(公告)日：2017-06-22

申请号：US14978358

申请日：2015-12-22

Applicant: Raytheon Company

Inventor： Joseph M. Wahl ,  Travis L. Mayberry ,  Gregory G. Beninati

IPC: H01L23/373 ,  H01L23/473 ,  H01L23/467 ,  H01L21/48 ,  H01L23/367

CPC classification number: H01L23/3732 ,  H01L21/481 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/373 ,  H01L23/467 ,  H01L23/473

Abstract: A method for forming a cooling structure having a plurality of cooling members. The method includes: providing a template having a plurality of features, such members projecting outward from a base of a template or holes passing into the template, the features being arranged in a predetermined pattern, such pattern being selected in accordance with the predetermined pattern of cooling members; and forming a conformal coating of diamond over the features.