-
公开(公告)号：US20180297144A1
公开(公告)日：2018-10-18
申请号：US15486724
申请日：2017-04-13
Applicant: Raytheon Company
Inventor： Travis L. Mayberry , James A. Pruett , Craig H. McCordic , David H. Altman
IPC: B23K20/10 , B23K1/00 , B23K31/02 , B33Y10/00 , B33Y80/00 , B23K20/00 , F28F3/08 , F28F9/02 , F28F21/08
Abstract: A manifold structure has at least one flow passage and a center manifold section that has at least one machined cavity. The manifold structure includes a plurality of ultrasonically additively manufactured (UAM) finstock layers arranged in the flow passage. After the finstock is formed by UAM, the finstock is permanently joined to the center manifold section via a brazing or welding process. Using UAM and a permanent joining process enables joining of the UAM finstock having enhanced thermal features to a vacuum brazement structure. UAM enables the finstock to be formed of dissimilar metal materials or multi-material laminate materials. UAM also enables bond joints of the finstock to be arranged at angles greater than ten degrees relative to a horizontal axis by using the same aluminum material in the UAM process and in the vacuum brazing process.
-
公开(公告)号：US10682734B2
公开(公告)日：2020-06-16
申请号：US15176733
申请日：2016-06-08
Applicant: Raytheon Company
Inventor： Michael L. Andersen , Travis L. Mayberry , James A. Pruett , John S. Moore
Abstract: A manifold structure and method of forming a manifold structure includes using an ultrasonic additive manufacturing (UAM) process to build up a solid structure, machining the solid structure to form a cavity and free-standing support pillars within the cavity, and using a UAM process to build up a finstock layer over the cavity. The support pillars formed by machining have yield strengths high enough to support UAM of the finstock layer over the cavity. A plurality of finstock layers are built up within the cavity to segment the cavity into a plurality of cavities. UAM of the finstock layers enables the finstock layers to be stacked in a direction normal to a direction of flow through the cavity for efficiently transferring heat through the manifold structure.
-
公开(公告)号：US20210129261A1
公开(公告)日：2021-05-06
申请号：US16668193
申请日：2019-10-30
Applicant: Raytheon Company
Inventor： Travis L. Mayberry , Craig H. McCordic , Joseph R. Ellsworth
Abstract: A method of forming a cooling structure for a heat-dissipating surface includes arranging a heat spreader layer adjacent the heat-dissipating surface, bonding a coldplate directly to the heat spreader layer opposite the heat-dissipating surface, and forming an intermetallic bond between the heat spreader layer and the coldplate. The coldplate is bonded to the heat spreader layer using ultrasonic additive manufacturing.
-
公开(公告)号：US20170304964A1
公开(公告)日：2017-10-26
申请号：US15137370
申请日：2016-04-25
Applicant: Raytheon Company
Inventor： Michael L. Andersen , Travis L. Mayberry , Gregory P. Schaefer
IPC: B23K37/00 , B23K20/10 , F28F9/02 , B23K101/14 , B33Y10/00 , B23K103/10 , B33Y80/00
CPC classification number: F28F9/02 , B23K20/10 , B23K20/103 , B23K20/22 , B23K20/2336 , B23K2101/14 , B23K2103/08 , B23K2103/10 , B33Y10/00 , B33Y80/00 , F28F7/02 , F28F2250/106
Abstract: A manifold structure and method of forming a structure having at least one enclosed cavity includes using an ultrasonic additive manufacturing (UAM) process to build up a solid component, forming a cavity in the solid component, filling the cavity with a sacrificial material, using a UAM process to build up a finstock layer over the cavity filled with the powder material to enclose the cavity and form the enclosed cavity, and removing the sacrificial material from the enclosed cavity after the finstock layer is ultrasonically welded to the solid component. The sacrificial material has an adequate density to support the UAM process of forming the finstock layer over the cavity and the material may be removed from the enclosed cavity, resulting in an enclosed cavity having smooth surfaces with an optimal fluid flow area therethrough.
-
公开(公告)号：US20170178996A1
公开(公告)日：2017-06-22
申请号：US14978358
申请日：2015-12-22
Applicant: Raytheon Company
Inventor： Joseph M. Wahl , Travis L. Mayberry , Gregory G. Beninati
IPC: H01L23/373 , H01L23/473 , H01L23/467 , H01L21/48 , H01L23/367
CPC classification number: H01L23/3732 , H01L21/481 , H01L23/3675 , H01L23/3677 , H01L23/373 , H01L23/467 , H01L23/473
Abstract: A method for forming a cooling structure having a plurality of cooling members. The method includes: providing a template having a plurality of features, such members projecting outward from a base of a template or holes passing into the template, the features being arranged in a predetermined pattern, such pattern being selected in accordance with the predetermined pattern of cooling members; and forming a conformal coating of diamond over the features.
-
Patent Agency Ranking
公开(公告)号：US20220003509A1
公开(公告)日：2022-01-06
申请号：US17481741
申请日：2021-09-22
Applicant: Raytheon Company
Abstract: A method of forming a thermal energy storage unit for a surface to be cooled or heated includes using an additive manufacturing process to form a plurality of non-rectilinear structures having a plurality of thermally conductive substructures, the substructures defining a plurality of interior cavities within the substructures and a plurality of exterior fluid channels that cross over or under the plurality of interior cavities, arranging the plurality of non-rectilinear structures in a plurality of housings, wherein each of the plurality of non-rectilinear structures is arranged in a corresponding one of the plurality of housings, and connecting the plurality of housings to each other to build up the thermal energy storage unit whereby the thermal energy storage unit is modular.
-
公开(公告)号：US20200309466A1
公开(公告)日：2020-10-01
申请号：US16364310
申请日：2019-03-26
Applicant: Raytheon Company
Inventor： Travis L. Mayberry , Justin D. Wenning
Abstract: A manifold structure is formed using ultrasonic additive manufacturing and machining. The manifold structure includes a body having a base plate and a cover plate that define a flow passage therebetween, and a plurality of walls that segment the flow passage into a plurality of channels, wherein each of the walls has a height extending from the base plate to the cover plate and a non-linear length that is elongated relative to a width of the wall and extends in a direction normal to the height of the wall. The walls are wavy in shape to provide enhanced rigidity and stiffness during lamination over the channels.
-
公开(公告)号：US10766097B2
公开(公告)日：2020-09-08
申请号：US15486724
申请日：2017-04-13
Applicant: Raytheon Company
Inventor： Travis L. Mayberry , James A. Pruett , Craig H. McCordic , David H. Altman
IPC: B23K20/10 , B33Y10/00 , B33Y80/00 , F28F3/08 , F28F9/02 , F28F21/08 , B23P15/26 , F28F3/06 , F28F3/12 , F28D9/00 , F28F3/02 , B23K20/22 , F28F3/04 , H05K7/20 , B23K20/233 , B23K101/14 , B23K103/10
Abstract: A manifold structure has at least one flow passage and a center manifold section that has at least one machined cavity. The manifold structure includes a plurality of ultrasonically additively manufactured (UAM) finstock layers arranged in the flow passage. After the finstock is formed by UAM, the finstock is permanently joined to the center manifold section via a brazing or welding process. Using UAM and a permanent joining process enables joining of the UAM finstock having enhanced thermal features to a vacuum brazement structure. UAM enables the finstock to be formed of dissimilar metal materials or multi-material laminate materials. UAM also enables bond joints of the finstock to be arranged at angles greater than ten degrees relative to a horizontal axis by using the same aluminum material in the UAM process and in the vacuum brazing process.
-
公开(公告)号：US10443958B2
公开(公告)日：2019-10-15
申请号：US15137370
申请日：2016-04-25
Applicant: Raytheon Company
Inventor： Michael L. Andersen , Travis L. Mayberry , Gregory P. Schaefer
IPC: B23K1/06 , F28F9/02 , B23K20/10 , B23K20/22 , B23K20/233 , F28F7/02 , B33Y10/00 , B33Y80/00 , B23K101/14 , B23K103/10 , B23K103/08
Abstract: A manifold structure and method of forming a structure having at least one enclosed cavity includes using an ultrasonic additive manufacturing (UAM) process to build up a solid component, forming a cavity in the solid component, filling the cavity with a sacrificial material, using a UAM process to build up a finstock layer over the cavity filled with the powder material to enclose the cavity and form the enclosed cavity, and removing the sacrificial material from the enclosed cavity after the finstock layer is ultrasonically welded to the solid component. The sacrificial material has an adequate density to support the UAM process of forming the finstock layer over the cavity and the material may be removed from the enclosed cavity, resulting in an enclosed cavity having smooth surfaces with an optimal fluid flow area therethrough.
-
公开(公告)号：US11305373B2
公开(公告)日：2022-04-19
申请号：US16668193
申请日：2019-10-30
Applicant: Raytheon Company
Inventor： Travis L. Mayberry , Craig H. McCordic , Joseph R. Ellsworth
IPC: B23K20/10 , H01L21/48 , H01L23/427 , B33Y70/00 , B33Y80/00 , B33Y10/00 , H01L23/367 , B23K103/10
Abstract: A method of forming a cooling structure for a heat-dissipating surface includes arranging a heat spreader layer adjacent the heat-dissipating surface, bonding a coldplate directly to the heat spreader layer opposite the heat-dissipating surface, and forming an intermetallic bond between the heat spreader layer and the coldplate. The coldplate is bonded to the heat spreader layer using ultrasonic additive manufacturing.
-
-
-
-
-
-
-
-
-
Search Results
13
records
(took 0.012 seconds)
