Abstract:
A process sensor assembly comprises a hollow protective housing, a temperature sensor, a process transmitter, and a transient protector. The temperature sensor includes a probe extending out of the hollow protective housing to a sensing location, and a top plate movably secured to the hollow protective housing so as to allow travel within the hollow protective housing with vibrations of the probe. The process transmitter is configured to process and transmit sensor signals from the temperature sensor, and is retained on the top plate to move with the temperature sensor within the hollow protective housing. The transient protector is configured to condition power for to the process transmitter, and is anchored to the process transmitter so as to move with the process transmitter within the hollow protective housing.
Abstract:
A field device for use in an industrial process includes a housing having a cavity formed therein. A humidity-sealed electronics module has a first compartment formed therein and is positioned in the cavity. The humidity-sealed electronics module includes a seal board. The seal board separates the first compartment of the humidity sealed electronics module from a second compartment in the housing. A first electrical component in the first compartment is mounted to the seal board and a second electrical component in the second compartment is electrically connected to the first electrical component.