公开(公告)号：US06770705B2

公开(公告)日：2004-08-03

申请号：US10361096

申请日：2003-02-06

申请人： Noel R. Vanier ,  Calum H. Munro ,  Gregory J. McCollum ,  James B. O'Dwyer ,  Cynthia Kutchko

发明人： Noel R. Vanier ,  Calum H. Munro ,  Gregory J. McCollum ,  James B. O'Dwyer ,  Cynthia Kutchko

IPC分类号： C08F21604

CPC分类号： C08L33/06 ,  C08K3/22 ,  C08K3/36 ,  C09D7/61 ,  C09D7/67 ,  C09D133/06

摘要： A curable film-forming composition is provided comprising in a medium (i) 10 to 90 percent by weight based on the total weight of solids in the film-forming composition of a crosslinking agent; (ii) 10 to 90 percent by weight based on the total weight of solids in the film-forming composition of a polymer containing a plurality of functional groups reactive with the crosslinking agent; and (iii) at least 20 percent by volume based on the total volume of the film-forming composition of particles having a mean particle size less than 100 nm. A cured composition comprising the crosslinking agent of (i) and the polymer of (ii) has a cured softening point of less than 30° C. The particles of component (iii) further have a hardness value greater than 5 on the Moh hardness scale, and have an affinity for the medium sufficient to keep the particles suspended therein. The affinity of the particles for the medium is greater than the affinity of the particles for each other, thereby preventing agglomeration of the particles within the medium. Cured compositions having a film thickness of at least 5 microns demonstrate excellent chip resistance, superior sandability and resistance to scratching, water spotting and acid etch.

摘要翻译： 提供了一种可固化成膜组合物，其包含在基于成膜组合物中交联剂的固体总重量的10至90重量％的介质中（i） （ii）10至90重量％，基于成膜组合物中含有与交联剂反应的多个官能团的聚合物的固体总重量; 和（iii）基于平均粒径小于100nm的成膜组合物的总体积至少20体积％。 包含（i）的交联剂和（ii）的聚合物的固化组合物的固化软化点小于30℃。组分（iii）的颗粒在莫氏硬度标度上还具有大于5的硬度值 并且对于足以使颗粒悬浮在其中的介质具有亲和力。 颗粒对介质的亲和力大于颗粒彼此的亲和力，从而防止颗粒在介质中的团聚。具有至少5微米的膜厚度的组合物表现出优异的耐碎性，优异的耐砂性和耐电性 划伤，水渍和酸蚀。