公开(公告)号：US20140014504A1

公开(公告)日：2014-01-16

申请号：US13650073

申请日：2012-10-11

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： You Jung Roh ,  Chul Kyu Kim

IPC: C25D17/02

CPC classification number: C25D17/008 ,  C25D17/001

Abstract: Disclosed herein is a plating apparatus, including: a plating tank receiving a plating solution and having an article to be plated injected thereinto; an anode disposed to face one surface or both surfaces of the article to be plated; and a shielding member disposed between the article to be plated and the anode and configured of a first plate and a second plate adjacently disposed to the first plate, the first plate and the second plate moving in parallel with each other.

Abstract translation: 本发明公开了一种电镀装置，其特征在于，包括：接受电镀液的电镀槽，其中注入有电镀物品; 被设置为面对被镀物品的一个表面或两个表面的阳极; 以及屏蔽构件，其设置在所述待镀物品与所述阳极之间，并且由与所述第一板相邻配置的第一板和第二板构成，所述第一板和所述第二板彼此平行地移动。