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公开(公告)号：US10685926B2
公开(公告)日：2020-06-16
申请号：US16284289
申请日：2019-02-25
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jae Hyun Lim , Han Kim , Chul Kyu Kim , Sang Jong Lee , Jung Ho Shim
Abstract: An antenna module includes an antenna substrate including a core layer, insulating layers disposed on opposite surfaces of the core layer, and wiring layers including antenna patterns. The antenna substrate has first and second recess portions. The antenna module further includes a passive component disposed in the first recess portion, a semiconductor chip disposed in the second recess portion and having an active surface, an encapsulant encapsulating at least portions of the semiconductor chip and the passive component, and a connection portion disposed on the active surface of the semiconductor chip and including redistribution layers electrically connected to the semiconductor chip. The passive component has a thickness greater than that of the semiconductor chip, and the first recess portion has a depth greater than that of the second recess portion.
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公开(公告)号：US10170386B2
公开(公告)日：2019-01-01
申请号：US15667738
申请日：2017-08-03
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Seung On Kang , Woo Sung Han , Young Gwan Ko , Chul Kyu Kim , Han Kim
IPC: H01L23/02 , H01L23/31 , H01L23/16 , H01L23/552 , H01L23/00 , H01L23/36 , H01L23/498 , H01L23/538 , H01L21/48 , H01L21/56 , H01L23/522 , H01L23/29 , H01L23/367
Abstract: An electronic component package includes a frame having a cavity, an electronic component disposed in the cavity of the frame, a first metal layer disposed on an inner wall of the cavity of the frame, an encapsulant encapsulating the electronic component, and a redistribution layer disposed below the frame and the electronic component.
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公开(公告)号：US09842789B2
公开(公告)日：2017-12-12
申请号：US15140775
申请日：2016-04-28
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Seung On Kang , Woo Sung Han , Young Gwan Ko , Chul Kyu Kim , Han Kim
IPC: H01L23/02 , H01L23/31 , H01L23/16 , H01L23/552 , H01L23/00 , H01L23/36 , H01L23/538 , H01L23/29 , H01L23/367 , H01L23/498
CPC classification number: H01L23/3128 , H01L21/4857 , H01L21/56 , H01L23/16 , H01L23/295 , H01L23/36 , H01L23/3677 , H01L23/49816 , H01L23/5226 , H01L23/5389 , H01L23/552 , H01L24/19 , H01L24/20 , H01L24/96 , H01L24/97 , H01L2224/04105 , H01L2224/12105 , H01L2924/1431 , H01L2924/1432 , H01L2924/1433 , H01L2924/14335 , H01L2924/1436 , H01L2924/1438 , H01L2924/145 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/3025 , H01L2924/3511
Abstract: An electronic component package includes a frame having a cavity, an electronic component disposed in the cavity of the frame, a first metal layer disposed on an inner wall of the cavity of the frame, an encapsulant encapsulating the electronic component, and a redistribution layer disposed below the frame and the electronic component.
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公开(公告)号：US11683569B2
公开(公告)日：2023-06-20
申请号：US17071366
申请日：2020-10-15
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Sung Han Kim , Han Kim , Young Bok Yoon , Seok Hwan Kim , Tae Ho Yun , Kyung Ho Lee , Jong Gil Won , Chul Kyu Kim , Jong Man Kim
CPC classification number: H04N23/51 , H04N23/54 , H04N23/57 , H04N23/687 , H05K1/0278
Abstract: An optical assembly includes: a camera module; at least one actuator configured to move the camera module; and a connection substrate having one end connected to the camera module such that at least a portion of the connection substrate is configured to move along with movement of the camera module. The connection substrate includes a rigidity reduction portion reducing rigidity of the connection substrate in a portion of the substrate in which distortion or warpage occurs according to the movement of the camera module.
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公开(公告)号：US10804215B2
公开(公告)日：2020-10-13
申请号：US16418876
申请日：2019-05-21
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jae Hyun Lim , Sang Jong Lee , Chul Kyu Kim , Yoon Seok Seo
IPC: H01L23/552 , H01L23/498 , H01L23/00 , H01L23/522 , H01L23/31
Abstract: A semiconductor package comprising: a frame having an opening and including wiring layers and one or more layer of connection vias; a semiconductor chip disposed in the opening and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant covering the frame and the semiconductor chip and filling the opening; a connection structure disposed on the frame and the active surface of the semiconductor chip, and including one or more redistribution layers electrically connected to the connection pads and the wiring layers; one or more passive components disposed on the connection structure; a molding material covering each of the passive components; and a metal layer covering outer surfaces of each of the frame, the connection structure, and the molding material. The metal layer is connected to a ground pattern included in the wiring layers of the frame.
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Patent Agency Ranking
公开(公告)号：US10218219B2
公开(公告)日：2019-02-26
申请号：US15200371
申请日：2016-07-01
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Chul Kyu Kim , Han Kim , Kyung Hyun Park , Ki Won Chang , Jung Wook Seo , Jae Suk Sung
Abstract: A coil device comprises a first coil, a second coil, a first conductor, and a first film. The second coil is disposed inside an inner boundary line of the first coil. The first conductor is disposed between the inner boundary line of the first coil and an outer boundary line of the second coil to dissipate heat. The first film is disposed on upper surfaces of the first coil, the second coil, and the first conductor.
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公开(公告)号：US11711602B2
公开(公告)日：2023-07-25
申请号：US17243676
申请日：2021-04-29
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Tae Ho Yun , Sang Jong Lee , Kyung Ho Lee , Chul Kyu Kim , Han Kim
CPC classification number: H04N23/55 , H04M1/0264 , H04N23/54 , H04M2250/52
Abstract: A camera module is provided. The camera module includes a lens module having at least one lens; a housing, configured to accommodate the lens module; and a driving unit, disposed between the lens module and the housing, and including a magnet portion and a coil portion, wherein the coil portion is disposed to surround the magnet portion.
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公开(公告)号：US11037884B2
公开(公告)日：2021-06-15
申请号：US16433439
申请日：2019-06-06
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Yoon Seok Seo , Dae Hyun Park , Sang Jong Lee , Chul Kyu Kim , Jae Hyun Lim
IPC: H01L23/552 , H01L23/538 , H01L23/28
Abstract: A semiconductor package includes: a frame having a first surface and a second surface opposing each other, and including a through-hole and a wiring structure connected to the first surface and the second surface; a connection structure disposed on the first surface of the frame and including a redistribution layer; a semiconductor chip disposed in the through-hole and including connection pads connected to the redistribution layer; an encapsulant encapsulating the semiconductor chip and covering the second surface of the frame; and a plurality of electrical connection metal members disposed on the second surface of the frame and connected to the wiring structure. The wiring structure includes a shielding wiring structure surrounding the through-hole, and the plurality of electrical connection metal members include a plurality of grounding electrical connection metal members connected to the shielding wiring structure.
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公开(公告)号：US20200176391A1
公开(公告)日：2020-06-04
申请号：US16418876
申请日：2019-05-21
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jae Hyun Lim , Sang Jong Lee , Chul Kyu Kim , Yoon Seok Seo
IPC: H01L23/552 , H01L23/498 , H01L23/00 , H01L23/522 , H01L23/31
Abstract: A semiconductor package comprising: a frame having an opening and including wiring layers and one or more layer of connection vias; a semiconductor chip disposed in the opening and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant covering the frame and the semiconductor chip and filling the opening; a connection structure disposed on the frame and the active surface of the semiconductor chip, and including one or more redistribution layers electrically connected to the connection pads and the wiring layers; one or more passive components disposed on the connection structure; a molding material covering each of the passive components; and a metal layer covering outer surfaces of each of the frame, the connection structure, and the molding material. The metal layer is connected to a ground pattern included in the wiring layers of the frame.
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公开(公告)号：US20200020653A1
公开(公告)日：2020-01-16
申请号：US16284289
申请日：2019-02-25
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jae Hyun Lim , Han Kim , Chul Kyu Kim , Sang Jong Lee , Jung Ho Shim
Abstract: An antenna module includes an antenna substrate including a core layer, insulating layers disposed on opposite surfaces of the core layer, and wiring layers including antenna patterns. The antenna substrate has first and second recess portions. The antenna module further includes a passive component disposed in the first recess portion, a semiconductor chip disposed in the second recess portion and having an active surface, an encapsulant encapsulating at least portions of the semiconductor chip and the passive component, and a connection portion disposed on the active surface of the semiconductor chip and including redistribution layers electrically connected to the semiconductor chip. The passive component has a thickness greater than that of the semiconductor chip, and the first recess portion has a depth greater than that of the second recess portion.
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