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公开(公告)号:US10923276B2
公开(公告)日:2021-02-16
申请号:US15970138
申请日:2018-05-03
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Young Il Lee , Han Wool Ryu , Sang Kyun Kwon
Abstract: A coil electronic component includes a body having a coil portion embedded therein and having a form in which magnetic particles are dispersed in a first insulating material, a first atomic layer deposition (ALD) layer formed along a surface of the coil portion using a second insulating material, a second ALD layer formed along a surface of the first ALD layer using a third insulating material, and external electrodes connected to the coil portion.
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公开(公告)号:US11495398B2
公开(公告)日:2022-11-08
申请号:US16003901
申请日:2018-06-08
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Young Il Lee , Han Wool Ryu , Sang Kyun Kwon
IPC: H01F27/29 , H01F27/32 , H01F1/147 , H01F27/255 , H01F17/04 , H01F17/00 , C23C16/455 , H01F1/26 , C23C16/40 , H01F1/33 , H01F41/02
Abstract: A coil electronic component includes a body including an insulator; a coil portion embedded in the body; aggregates dispersed in the insulator, where the aggregates each comprise a plurality of magnetic particles, coating layers formed on surfaces of the aggregates using an insulating material, and external electrodes connected to the coil portion.
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公开(公告)号:US11289251B2
公开(公告)日:2022-03-29
申请号:US16013588
申请日:2018-06-20
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Sang Kyun Kwon , Han Wool Ryu , Chang Hak Choi
IPC: H01F1/147 , B22F1/00 , H01F27/255 , H01F41/02 , H01F1/20 , H01F1/153 , H01F27/29 , H01F17/00 , C22C33/02 , H01F17/04
Abstract: A coil component includes a body in which a coil portion is disposed, and external electrodes connected to the coil portion. The body includes metal particles formed of an Fe-based nanocrystal grain alloy, and the Fe-based nanocrystal grain alloy has one peak or two peaks in a differential scanning calorimetry (DSC) graph, and when the Fe-based nanocrystal grain alloy has the two peaks, a primary peak is smaller than a secondary peak, where the primary peak is at a lower temperature than the secondary peak.
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公开(公告)号:US10902988B2
公开(公告)日:2021-01-26
申请号:US15146470
申请日:2016-05-04
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Woon Chul Choi , Jung Hyuk Jung , Woo Jin Lee , Han Wool Ryu
Abstract: A coil electronic component includes a magnetic body that includes a substrate and a coil part. The coil part includes patterned insulating films disposed on a surface of the substrate and a plating layer formed between the patterned insulating films by plating and having a thickness greater than or equal to its width measured parallel to the surface of the substrate. The plating layer may be formed in a single plating operation, and may have a thickness of 200 μm or more.
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公开(公告)号:US10861637B2
公开(公告)日:2020-12-08
申请号:US15824195
申请日:2017-11-28
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Hwan Soo Lee , Han Wool Ryu , Hyo Chan Oh , Jin Ho Ku , Byoung Hwa Lee
Abstract: A coil component includes a support member, an internal coil supported by the support member, and external electrodes connected to the internal coil. The external electrodes may each include a first layer coming into contact with the internal coil and a second layer disposed on a surface of the first layer. The first layer may serve as a buffer layer for improving a contact property between the internal coil and the external electrode. The second layer may be disposed to come into at least partial contact with a first end portion of the support member and a second end portion of the support member.
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公开(公告)号:US10861630B2
公开(公告)日:2020-12-08
申请号:US15581123
申请日:2017-04-28
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Han Wool Ryu , Jung Hyuk Jung , Hyo Chan Oh , Yoon Hee Kim , Woon Chul Choi , Jin Ho Ku , Il Jin Park
Abstract: An inductor includes a body having a first magnetic portion above and below a coil, and a second magnetic portion above and below the first magnetic portion. The magnetic flux density of the magnetic substance in the first magnetic portion is higher than that of the magnetic substance in the second magnetic portion.
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公开(公告)号:US10431368B2
公开(公告)日:2019-10-01
申请号:US15253130
申请日:2016-08-31
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Woon Chul Choi , Ji Hye Oh , Jung Hyuk Jung , Han Wool Ryu
IPC: H01F5/00 , H01F27/28 , H01F27/02 , H01F27/245 , H01F27/255 , H01F41/02 , H01F41/12 , H01F41/16 , H01F41/34
Abstract: A coil electronic component includes a magnetic body, wherein the magnetic body includes a substrate, and a coil part including patterned insulating films disposed on the substrate, a first plating layer formed between the patterned insulating films by plating, and a second plating layer disposed on the first plating layer.
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