公开(公告)号：US20160037645A1

公开(公告)日：2016-02-04

申请号：US14807598

申请日：2015-07-23

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jae Ean LEE ,  Jee Soo MOK ,  Young Gwan KO ,  Kyung Hwan KO ,  Yong Ho BAEK

IPC: H05K1/18 ,  H05K1/02 ,  H05K3/46 ,  H05K3/30 ,  H05K3/40 ,  H05K1/11 ,  H05K3/24

CPC classification number: H05K3/4697 ,  H01L2224/16225 ,  H05K1/185 ,  H05K1/186 ,  H05K3/24 ,  H05K3/4602 ,  H05K3/4617 ,  H05K2201/096 ,  H05K2201/10

Abstract: An embedded board and a method of manufacturing the same are provided. The embedded board includes a core substrate below which a mounting pad is formed, a first substrate formed below the core substrate and having a first cavity formed therein, and a second substrate formed below the first substrate and having a second cavity formed therein. The first cavity and the second cavity are connected to each other and externally expose the mounting pad.

Abstract translation: 提供嵌入式电路板及其制造方法。 嵌入式基板包括芯基板，在其下方形成有安装焊盘，第一基板形成在芯基板下方并且具有形成在其中的第一腔体，第二基板形成在第一基板下方并且在其中形成有第二腔。 第一腔体和第二腔体彼此连接并从外部暴露安装垫。