公开(公告)号：US20190172793A1

公开(公告)日：2019-06-06

申请号：US15923308

申请日：2018-03-16

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Han KIM ,  Sung Han KIM ,  Seok Hwan KIM

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498

Abstract: A fan-out semiconductor package includes: a semiconductor chip having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the semiconductor chip; a connection member disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads; a passivation layer disposed on the connection member and having openings exposing at least portions of the redistribution layer; metal members disposed in the openings of the passivation layer and connected to the exposed redistribution layer; and electrical connection structures disposed on the passivation layer and connected to the metal members, wherein the electrical connection structures have heights hierarchically differentiated from one another depending on sizes of the metal members.

公开(公告)号：US20170372995A1

公开(公告)日：2017-12-28

申请号：US15457260

申请日：2017-03-13

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sung Han KIM ,  Masazumi AMAGAI ,  Ju Ho KIM ,  Tae Sung JEONG

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/00

Abstract: A fan-out semiconductor package includes connection pads of a semiconductor chip that are redistributed and electrically connected to connection terminals by an interconnection member. In the fan-out semiconductor package, disposition forms of vias and pads in the interconnection member are designed so that stress may be reduced, such that reliability is improved.

公开(公告)号：US20140178800A1

公开(公告)日：2014-06-26

申请号：US13845026

申请日：2013-03-17

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sung Han KIM ,  Jong Ho Chung ,  Jong Sik Yoon ,  Bon Seok Koo

IPC: H01M8/02

CPC classification number: H01M8/0228 ,  C04B37/021 ,  C04B2237/066 ,  C04B2237/068 ,  C04B2237/62 ,  C04B2237/68 ,  H01M8/0206 ,  H01M8/0215 ,  H01M2008/1293 ,  Y02E60/50 ,  Y02E60/525 ,  Y02P70/56

Abstract: Disclosed herein are an interconnect for a solid oxide fuel cell and a method for manufacturing the same, the interconnect including: a conductive core; an oxidation-resistant insulating part receiving therein; and an oxidation-resistant conductive material layer coated on an exposed surface of the conductive core, which is exposed to an external environment by removing a portion of the oxidation-resistant insulating part, so that the interconnect can maintain durability against high-temperature heat generated from a flat type solid oxide fuel cell for a long time and thus have a very small voltage loss due to oxidation even with the use over a long-time period; have no sealing problem and no delaminating problem of a coating film due to a difference in coefficient of thermal expansion; be inexpensive; and have a simple structure.

Abstract translation: 本文公开了一种固体氧化物燃料电池的互连及其制造方法，所述互连包括：导电芯; 接收其中的抗氧化绝缘部件; 以及通过除去一部分耐氧化绝缘部分而暴露在外部环境中的涂覆在导电芯的暴露表面上的抗氧化导电材料层，使得互连可以保持对产生的高温热的耐久性 从扁平型固体氧化物燃料电池长时间，即使长时间使用也因氧化而具有非常小的电压损失; 由于热膨胀系数的差异，没有涂膜的密封问题和涂膜的脱层问题; 价格便宜 并具有简单的结构。