公开(公告)号：US20140126104A1

公开(公告)日：2014-05-08

申请号：US13747045

申请日：2013-01-22

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Wi Heon KIM ,  Doo Young KIM ,  Jae Yeol CHOI

IPC: H01G4/12

CPC classification number: H01G4/1209

Abstract: There is provided a multilayered ceramic electronic component including: a ceramic body including dielectric layers having an average thickness of 0.6 μm or less; and first and second internal electrodes, wherein the ceramic body includes a capacitance formation part and a non-capacitance formation part provided on at least one surface of upper and lower surfaces of the capacitance formation part, and when the capacitance formation part is divided into three regions in a thickness direction of the ceramic body, in a central region among the three regions, dielectric grains have an average particle size of 150 nm or less, and the number of dielectric grains per layer is 4 or more, and in upper and lower regions, dielectric grains have an average particle size of 200 nm or less, respectively, and the number of dielectric grains per layer is 3 or more.

Abstract translation: 提供一种多层陶瓷电子部件，其包括：陶瓷体，其包含平均厚度为0.6μm以下的电介质层; 以及第一和第二内部电极，其中陶瓷体包括电容形成部分和设置在电容形成部分的上表面和下表面的至少一个表面上的非电容形成部分，并且当电容形成部分被分为三个 陶瓷体的厚度方向的区域，在三个区域的中心区域中，电介质粒子的平均粒径为150nm以下，每层的电介质粒子数为4以上，上下 区域，电介质粒子的平均粒径分别为200nm以下，每层的电介质粒数为3个以上。