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    MULTILAYER CERAMIC CAPACITOR AND ASSEMBLY BOARD HAVING THE SAME
    3.
    发明申请
    MULTILAYER CERAMIC CAPACITOR AND ASSEMBLY BOARD HAVING THE SAME 有权
    多层陶瓷电容器及其组装板

    公开(公告)号：US20150287533A1

    公开(公告)日：2015-10-08

    申请号：US14444587

    申请日：2014-07-28

    申请人： Samsung Electro-Mechanics Co., Ltd.

    发明人： Jong Ho LEE ,  Doo Young KIM ,  Chang Hoon KIM ,  Myung Jun PARK

    IPC分类号： H01G4/30 ,  H01G4/248 ,  H05K1/11 ,  H01G2/06 ,  H01G4/12

    CPC分类号： H01G4/30 ,  H01G2/065 ,  H01G4/0085 ,  H01G4/12 ,  H01G4/1218 ,  H01G4/232 ,  H01G4/236 ,  H01G4/248 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/10636 ,  Y02P70/611

    摘要： A multilayer ceramic capacitor may include: a ceramic body having upper and lower surfaces opposing each other in a thickness direction thereof and first and second end surfaces opposing each other in a length direction thereof, a thickness of the ceramic body being greater than a width thereof; a first external electrode disposed on the first end surface to allow a predetermined region of the first end surface adjacent to the upper surface to be exposed; a second external electrode disposed on the second end surface to allow a predetermined region of the second end surface adjacent to the upper surface to be exposed; and first and second internal electrodes disposed within the ceramic body, stacked in a width direction of the ceramic body, and connected to the first and second external electrodes, respectively.

    摘要翻译： 多层陶瓷电容器可以包括：陶瓷体，其具有在其厚度方向上彼此相对的上表面和下表面以及在其长度方向上彼此相对的第一和第二端表面，陶瓷体的厚度大于其宽度 ; 设置在所述第一端面上以允许所述第一端面的与所述上表面相邻的预定区域被暴露的第一外部电极; 第二外部电极，设置在所述第二端面上，以允许所述第二端面的与所述上表面相邻的预定区域被露出; 以及设置在所述陶瓷体内的第一和第二内部电极，其分别在所述陶瓷体的宽度方向上层叠，并且分别与所述第一外部电极和所述第二外部电极连接。

    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
    5.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD HAVING THE SAME 有权
    多层陶瓷电子元件及其相应的板

    公开(公告)号：US20150124372A1

    公开(公告)日：2015-05-07

    申请号：US14259984

    申请日：2014-04-23

    申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

    发明人： Heung Kil PARK ,  Doo Young KIM ,  Young Ghyu AHN

    IPC分类号： H01G4/30

    CPC分类号： H01G4/30 ,  H01G4/1209 ,  H01G4/232

    摘要： A multilayer ceramic electronic component including: a ceramic body having a plurality of dielectric layers stacked therein; active layers including a plurality of first and second internal electrodes formed to be alternately exposed to both end surfaces of the ceramic body with the dielectric layers interposed therebetween; and first and second external electrodes formed on the both end surfaces of the ceramic body and electrically connected to the first and second internal electrodes, respectively. The active layers may include a first active layer including a ferroelectric layer and a second active layer including a paraelectric layer, the first and second active layers being alternately stacked.

    摘要翻译： 一种多层陶瓷电子部件，包括：陶瓷体，其中堆叠有多个电介质层; 活性层包括形成为交替地暴露于陶瓷体的两个端面的多个第一和第二内部电极，介电层插入其间; 以及第一和第二外部电极，其形成在陶瓷体的两个端面上并分别电连接到第一和第二内部电极。 有源层可以包括包括铁电层的第一有源层和包括顺电层的第二有源层，第一和第二有源层交替堆叠。

    MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME MOUNTED THEREON
    6.
    发明申请
    MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME MOUNTED THEREON 有权
    多层陶瓷电容器及其安装板

    公开(公告)号：US20150096795A1

    公开(公告)日：2015-04-09

    申请号：US14255397

    申请日：2014-04-17

    申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

    发明人： Kyung Pyo HONG ,  Doo Young KIM ,  Chang Hoon KIM ,  Sang Hyun PARK ,  Hae Sock CHUNG

    IPC分类号： H01G4/005 ,  H01G2/06 ,  H01G4/30

    CPC分类号： H01G2/065 ,  H01G4/012 ,  H01G4/12 ,  H01G4/30

    摘要： A multilayer ceramic capacitor may include: a ceramic body including dielectric layers; first and second internal electrodes disposed in the ceramic body; and first and second external electrodes formed to end surfaces of the ceramic body. The ceramic body may includes an active layer, a capacitance formation portion, and a cover layer, a non-capacitance formation portion, the cover layer includes a plurality of dummy electrode layers. When the number of the first and second internal electrodes is defined as AL, a thickness of each of the first and second internal electrodes is defined as AT, a thickness of each of the dummy electrode layers is defined as DT, and the number of the dummy electrode layers is defined as DL, DL is equal to {(T×x)−(AL×AT)}/DT, x being 9.0% or more.

    摘要翻译： 多层陶瓷电容器可以包括：包括电介质层的陶瓷体; 布置在陶瓷体中的第一和第二内部电极; 以及形成在陶瓷体的端面的第一外部电极和第二外部电极。 陶瓷体可以包括有源层，电容形成部分和覆盖层，非电容形成部分，覆盖层包括多个虚拟电极层。 当第一和第二内部电极的数量被定义为AL时，第一和第二内部电极的厚度被定义为AT，每个虚拟电极层的厚度被定义为DT，并且 虚拟电极层被定义为DL，DL等于{（T×x） - （AL×AT）} / DT，x为9.0％以上。

    MULTILAYER CERAMIC ELECTRONIC PART TO BE EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING MULTILAYER CERAMIC ELECTRONIC PART EMBEDDED THEREIN
    9.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC PART TO BE EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING MULTILAYER CERAMIC ELECTRONIC PART EMBEDDED THEREIN 有权
    多层陶瓷电子部件嵌入板和印刷电路板上嵌有多层陶瓷电子部件

    公开(公告)号：US20150021080A1

    公开(公告)日：2015-01-22

    申请号：US14149474

    申请日：2014-01-07

    申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

    发明人： Byoung Hwa LEE ,  Doo Young KIM ,  Hai Joon LEE ,  Jin Man JUNG

    IPC分类号： H01G4/005 ,  H05K1/18 ,  H01G4/30

    CPC分类号： H01G4/005 ,  H01G2/06 ,  H01G4/30 ,  H05K1/185 ,  H05K2201/10636 ,  Y02P70/611

    摘要： There is provided a multilayer ceramic electronic part to be embedded in a board including: a ceramic body including dielectric layers; an active layer including a plurality of first and second internal electrodes; upper and lower cover layers disposed on and below the active layer, respectively; and first and second external electrodes formed on both end portions of the ceramic body, wherein a first internal electrode positioned at an outermost position among the first electrodes is connected to the first external electrode by at least one first via extended to at least one of first and second main surfaces of the ceramic body, and a second internal electrode positioned at an outermost position among the second internal electrodes is connected to the second external electrode by at least one second via extended to at least one of first and second main surfaces of the ceramic body.

    摘要翻译： 本发明提供一种嵌入板的多层陶瓷电子部件，包括：包含电介质层的陶瓷体; 包括多个第一和第二内部电极的有源层; 分别设置在有源层上和下面的上和下覆盖层; 以及形成在所述陶瓷体的两端部的第一外部电极和第二外部电极，其中，位于所述第一电极中的最外侧位置的第一内部电极通过至少一个第一通孔连接到所述第一外部电极，所述至少一个第一通孔延伸至所述第一外部电极中的至少一个， 所述陶瓷体的第二主表面和位于所述第二内部电极中的最外侧位置的第二内部电极通过至少一个第二通孔延伸至所述第二外部电极的第一和第二主表面中的至少一个， 陶瓷体。

    DIELECTRIC COMPOSITION AND MULTI-LAYERED CERAMIC CAPACITOR
    10.
    发明申请
    DIELECTRIC COMPOSITION AND MULTI-LAYERED CERAMIC CAPACITOR 有权
    电介质组合物和多层陶瓷电容器

    公开(公告)号：US20150016017A1

    公开(公告)日：2015-01-15

    申请号：US14322521

    申请日：2014-07-02

    申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

    发明人： Jae Sung PARK ,  Sang Hyuk KIM ,  Chan Hee NAM ,  Chang Hoon KIM ,  Seok Hyun YOON ,  Doo Young KIM

    IPC分类号： C04B35/468 ,  H01G4/12 ,  H01G4/30

    CPC分类号： H01G4/1227 ,  C04B35/4682 ,  C04B35/47 ,  C04B2235/3206 ,  C04B2235/3239 ,  C04B2235/3241 ,  C04B2235/3262 ,  C04B2235/3272 ,  C04B2235/3275 ,  C04B2235/3279 ,  C04B2235/3281 ,  C04B2235/3284 ,  C04B2235/5445 ,  C04B2235/5454 ,  C04B2235/5472 ,  C04B2235/768 ,  C04B2235/77 ,  H01G4/12 ,  H01G4/30 ,  Y10T428/2982

    摘要： A dielectric composition may include a first dielectric powder; and a second dielectric powder having an average grain size smaller than that of the first dielectric powder and included in the dielectric composition in an amount of 0.01 to 1.5 parts by weight based on 100 parts by weight of the first dielectric powder, and a multilayer ceramic capacitor formed using the same. A multilayer ceramic capacitor may include: a ceramic body including dielectric layers; first and second internal electrodes disposed in the ceramic body to face each other with the respective dielectric layers interposed therebetween; and first and second external electrodes electrically connected to the first and second internal electrodes, respectively. The dielectric layers are formed of a dielectric composition including a first dielectric powder and a second dielectric powder having an average grain size smaller than that of the first dielectric powder and included in the dielectric composition in an amount of 0.01 to 1.5 parts by weight based on 100 parts by weight of the first dielectric powder.

    摘要翻译： 电介质组合物可以包括第一电介质粉末; 以及相对于第一电介质粉末100重量份，平均粒径小于第一电介质粉末的第二电介质粉末，其包含在电介质组合物中的量为0.01〜1.5重量份，多层陶瓷 电容器使用相同。 多层陶瓷电容器可以包括：包括电介质层的陶瓷体; 设置在陶瓷体中的第一和第二内部电极相互面对地插入介电层; 以及分别与第一和第二内部电极电连接的第一和第二外部电极。 电介质层由包括第一电介质粉末和第二电介质粉末的电介质组合物形成，所述第一电介质粉末和第二电介质粉末的平均晶粒尺寸小于第一电介质粉末的平均晶粒尺寸，并且包含在介电组合物中的量为0.01至1.5重量份，基于 100重量份的第一电介质粉末。