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公开(公告)号:US09893484B2
公开(公告)日:2018-02-13
申请号:US15612012
申请日:2017-06-02
Applicant: Samsung Electronics Co., Ltd.
Inventor: In-Jae Lee , Yong-Nam Koh , Ki-Woong Yoo
CPC classification number: H01R31/06 , G06F13/4068 , H01R12/7005 , H01R12/721
Abstract: A memory card adaptor is provided herein. The memory card adaptor may include a housing having a slot configured to accommodate a memory card. The memory card may include a signal terminal and non-signal terminals. For example, the signal terminal may be a high-speed and/or data transfer terminal, and the non-signal terminal may be a power or voltage terminal. The signal terminal may be at least partially exposed via a signal terminal opening in the housing when the memory card is accommodated in the slot. The memory card adaptor may also include at least one card-side terminal arranged so as to be capable of contacting at least one of the non-signal terminals. The at least one card-side terminal may be electrically connected, for example via a wiring line, to at least one socket-side terminal arranged so as to be capable of contacting terminals of a host socket
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公开(公告)号:USD783621S1
公开(公告)日:2017-04-11
申请号:US29553061
申请日:2016-01-28
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Designer: Jae-Bum Lee , Jae-Phill Kong , In-Jae Lee , Seung-Yong Shin , Seok-Heon Lee
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公开(公告)号:USD730909S1
公开(公告)日:2015-06-02
申请号:US29507137
申请日:2014-10-24
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Designer: Il-Mok Kang , Ki-Woong Yoo , In-Jae Lee , Gwang-Man Lim , Seok-Jae Han
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公开(公告)号:USD729251S1
公开(公告)日:2015-05-12
申请号:US29507464
申请日:2014-10-28
Applicant: Samsung Electronics Co., Ltd.
Designer: Il-Mok Kang , Ki-Woong Yoo , In-Jae Lee , Gwang-Man Lim , Seok-Jae Han
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公开(公告)号:USD727911S1
公开(公告)日:2015-04-28
申请号:US29507434
申请日:2014-10-28
Applicant: Samsung Electronics Co., Ltd.
Designer: Il-Mok Kang , Ki-Woong Yoo , In-Jae Lee , Gwang-Man Lim , Seok-Jae Han
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16.
公开(公告)号:US12191290B2
公开(公告)日:2025-01-07
申请号:US17671742
申请日:2022-02-15
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: In-Jae Lee
IPC: H01L23/48 , H01L21/56 , H01L23/31 , H01L25/16 , H01R13/66 , H01L23/00 , H01L23/24 , H01L23/498 , H01R24/62
Abstract: A semiconductor package includes a package substrate, a semiconductor chip on the package substrate, the semiconductor chip including a logic chip and a memory stack structure on the logic chip, a connector and a connector terminal below the package substrate, a molding layer that covers the semiconductor chip, the molding layer having a recess region on a top surface of the molding layer, a housing that covers the molding layer, and an air gap on the semiconductor chip, the air gap being defined by the housing and the recess region of the molding layer, and the molding layer separating the air gap from the memory stack structure of the semiconductor chip.
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公开(公告)号:US11307637B2
公开(公告)日:2022-04-19
申请号:US16931940
申请日:2020-07-17
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: In-Jae Lee , Min-Woo Kim , Seung Wan Koh
IPC: G06F1/3234 , G06F1/04 , G06F13/16 , H01R12/72
Abstract: A memory card includes a first ground terminal arranged in a first row that provides a ground voltage to at least one nonvolatile memory or a memory controller, universal flash storage (UFS) terminals arranged in a second row including a first UFS terminal that provides a second power, a second UFS terminal that provides a reference clock signal, and a third UFS terminal that provides a path for input/output data to the memory controller, and a first power terminal arranged in a third row that provides a first power supply voltage (VCC) to the at least one nonvolatile memory or the memory controller. The memory card has a size defined by a nano subscriber identification module (SIM) card standard, the first ground terminal corresponds to a “C5” terminal of the nano SIM card standard, and the first power terminal corresponds to a “C1” terminal of the nano SIM card standard.
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公开(公告)号:USD783622S1
公开(公告)日:2017-04-11
申请号:US29553081
申请日:2016-01-28
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Designer: Jae-Bum Lee , Jae-Phill Kong , In-Jae Lee , Seung-Yong Shin , Seok-Heon Lee
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公开(公告)号:USD736214S1
公开(公告)日:2015-08-11
申请号:US29513292
申请日:2014-12-30
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Designer: Il-Mok Kang , Ki-Woong Yoo , Gwang-Man Lim , In-Jae Lee , Seok-Jae Han
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公开(公告)号:USD727910S1
公开(公告)日:2015-04-28
申请号:US29507072
申请日:2014-10-23
Applicant: Samsung Electronics Co., Ltd.
Designer: Il-Mok Kang , Ki-Woong Yoo , Gwang-Man Lim , In-Jae Lee , Seok-Jae Han
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