公开(公告)号：US20210210397A1

公开(公告)日：2021-07-08

申请号：US17095210

申请日：2020-11-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： HYEONGMUN KANG ,  JUNGMIN KO ,  SEUNGDUK BAEK ,  TAEHYEONG KIM ,  INSUP SHIN

IPC: H01L23/24 ,  H01L23/00 ,  H01L23/31 ,  H01L23/538 ,  H01L21/56

Abstract: A semiconductor package includes a substrate, a plurality of semiconductor devices stacked on the substrate, a plurality of underfill fillets disposed between the plurality of semiconductor devices and between the substrate and the plurality of semiconductor devices, and molding resin surrounding the plurality of semiconductor devices. At least one of the underfill fillets is exposed from side surfaces of the molding resin.