公开(公告)号：US20190272885A1

公开(公告)日：2019-09-05

申请号：US16417834

申请日：2019-05-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kwang-Ho KIM ,  Jihwan YU ,  Seunghyun CHO

IPC: G11C19/28 ,  G11C11/412 ,  G11C8/14 ,  H01L27/11578 ,  H01L27/11582 ,  H01L27/11575 ,  H01L27/11573 ,  H01L27/1157 ,  H01L27/11565

Abstract: Disclosed is a three-dimensional semiconductor device including a stack structure on a substrate and including electrodes that are vertically stacked on top of each other on a first region of a substrate, a vertical structure penetrating the stack structure and including a first semiconductor pattern, a data storage layer between the first semiconductor pattern and at least one of the electrodes, a transistor on a second region of the substrate, and a first contact coupled to the transistor. The first contact includes a first portion and a second portion on the first portion. Each of the first portion and the second portions has a diameter that increases with an increasing vertical distance from the substrate. A diameter of an upper part of the first portion is greater than a diameter of a lower part of the second portion.

公开(公告)号：US20240288834A1

公开(公告)日：2024-08-29

申请号：US18624262

申请日：2024-04-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Taegyun KIM ,  Junghyun KANG ,  Kijung KIM ,  Shinhun MOON ,  Seunghyun CHO ,  Seongho HONG

IPC: G04G19/00 ,  A61B5/00 ,  A61B5/024 ,  G04G9/00 ,  G04G21/02 ,  H02J7/00 ,  H02J50/00 ,  H02J50/10 ,  H05K1/02 ,  H05K5/00

CPC classification number: G04G19/00 ,  G04G9/007 ,  G04G21/025 ,  H02J7/0042 ,  H02J50/005 ,  H05K1/028 ,  H05K5/0026 ,  A61B5/02416 ,  A61B5/681 ,  H02J50/10 ,  H05K2201/10106 ,  H05K2201/10151

Abstract: An electronic device is disclosed, including a housing having a front plate, a back plate facing the front plate, and a side frame surrounding a space defined between the front and back plates, a circuit board disposed within the housing, a module assembly disposed between the circuit board and the back plate, and electrically connected with the circuit board, wherein the module assembly includes: an optical sensor module including a flexible printed circuit board (FPCB) including a first surface and a second surface facing away from the first surface, a light emitting part disposed on the first surface of the FPCB, and a light receiving part disposed on the first surface spaced apart from the light emitting part, and a wireless charging module surrounding the FPCB of the optical sensor module, and at least partially coupled to the FPCB so as to be integrated with the FPCB.

公开(公告)号：US20230326930A1

公开(公告)日：2023-10-12

申请号：US18092241

申请日：2022-12-31

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seunghyun CHO ,  Jaemin JUNG

IPC: H01L27/12 ,  G09G3/20

CPC classification number: H01L27/124 ,  G09G3/2092 ,  G09G2300/0408

Abstract: A chip-on-film (COF) semiconductor package includes: a main film substrate having at least two module attachment regions spaced apart from each other; at least two sub-modules respectively attached to the at least two module attachment regions and spaced apart from each other on the main film substrate, wherein each of the at least two sub-modules comprise a sub-film substrate and a semiconductor chip mounted on the sub-film substrate; and at least two connection conductive layers provided between the main film substrate and the sub-film substrate, which is included in each of the at least two sub-modules, and electrically connecting the main film substrate to the at least two sub-modules.