公开(公告)号：US20210202788A1

公开(公告)日：2021-07-01

申请号：US17133657

申请日：2020-12-24

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Ik Kyu YOU

IPC: H01L33/00 ,  H01L25/075 ,  H01L21/66 ,  H01L33/62

Abstract: A flat bonding method of light emitting devices including bonding light emitting devices on a circuit board using a reflow process, and re-bonding at least a portion of the light emitting devices bonded on the circuit board using a press plate while pressing the portion of the light emitting devices.

公开(公告)号：US20210193497A1

公开(公告)日：2021-06-24

申请号：US17122995

申请日：2020-12-15

Applicant: SEOUL VIOSYS CO, LTD.

Inventor： Ik Kyu YOU ,  Jung Jae LEE

IPC: H01L21/683 ,  H01L25/075 ,  H01L33/62

Abstract: A method of transferring a plurality of micro LEDs formed on a substrate including transferring the micro LEDs onto a first carrier substrate having a first adhesive material layer, reducing an adhesiveness of the first adhesive material layer by curing the first adhesive material layer, transferring the micro LEDs from the first carrier substrate onto a second carrier substrate having a second adhesive material layer, bonding at least a portion of the micro LEDs on the second carrier substrate to pads of a circuit board using a metal bonding layer, and separating the second carrier substrate from the micro LEDs bonded onto the circuit board.