公开(公告)号：US20240113271A1

公开(公告)日：2024-04-04

申请号：US18522885

申请日：2023-11-29

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Ik Kyu YOU ,  Jung Jae LEE

IPC: H01L33/62 ,  H01L25/075

CPC classification number: H01L33/62 ,  H01L25/0753

Abstract: A display panel including a circuit board including first pads, first light emitting devices disposed on the circuit board and including pads, at least one second light emitting device disposed on the circuit board and including pads, metal bonding layers disposed between the pads of the first light emitting devices and the first pads on the circuit board, and a conductive material layer electrically connecting the pads of the second light emitting device to the first pads on the circuit board, in which the conductive material layer includes a conductive portion and a non-conductive portion.

公开(公告)号：US20220262993A1

公开(公告)日：2022-08-18

申请号：US17666202

申请日：2022-02-07

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Junhong MIN ,  Ik Kyu YOU

IPC: H01L33/58 ,  H01L25/075

Abstract: A pixel module includes a circuit board, a plurality of unit pixels arranged on the circuit board, and a molding member covering the plurality of unit pixels. The molding member includes a light diffusion layer and a black molding layer covering the light diffusion layer.

公开(公告)号：US20230081487A1

公开(公告)日：2023-03-16

申请号：US17990735

申请日：2022-11-20

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Jong Hyeon CHAE ,  Ik Kyu YOU ,  Seom Geun LEE ,  Seong Kyu JANG ,  Yong Woo RYU

IPC: H01L25/075 ,  H01L33/62 ,  H01L23/00

Abstract: A display panel including a circuit board having first pads, light emitting devices disposed on the circuit board and having second pads and including at least one first light emitting device to emit light having a first peak wavelength and second light emitting devices to emit light having a second peak wavelength, and a metal bonding layer electrically connecting the first pads and the second pads, in which the metal bonding layer of the first light emitting device has a thickness different from that of the metal bonding layer of the second light emitting devices while including a same material, and an upper surface of the second light devices are disposed at an elevation between an upper surface and a bottom surface of the first light emitting device.

公开(公告)号：US20230387085A1

公开(公告)日：2023-11-30

申请号：US18231614

申请日：2023-08-08

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Jong Hyeon CHAE ,  Ik Kyu YOU ,  Seom Geun LEE ,  Seong Kyu JANG ,  Yong Woo RYU

IPC: H01L25/075 ,  H01L33/62 ,  H01L23/00

CPC classification number: H01L25/0753 ,  H01L33/62 ,  H01L24/16 ,  H01L2224/16505 ,  H01L2224/16227

Abstract: A display panel including a circuit board having first pads, light emitting devices disposed on the circuit board and having second pads and including at least one first light emitting device to emit light having a first peak wavelength and second light emitting devices to emit light having a second peak wavelength, and a metal bonding layer electrically connecting the first pads and the second pads, in which the metal bonding layer of the first light emitting device has a thickness different from that of the metal bonding layer of the second light emitting devices while including a same material, and a surface of the second light devices are disposed at an elevation between an upper surface and a bottom surface of the first light emitting device.

公开(公告)号：US20220293832A1

公开(公告)日：2022-09-15

申请号：US17692699

申请日：2022-03-11

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Junhong MIN ,  Ik Kyu YOU

IPC: H01L33/58 ,  H01L25/075 ,  B29D11/00

Abstract: A method of manufacturing a light emitting module includes mounting a plurality of unit pixels on a module substrate, thermally curing a light diffusion film and a black film, laminating the light diffusion film and the black film, forming a molding layer to surround side surfaces of the plurality of unit pixels by disposing the laminated light diffusion film and the black film on the module substrate, and pressing the light diffusion film and the black film; and cutting and removing edges of the module substrate and the molding layer. The molding layer includes a light diffusion layer and a black molding layer disposed on the light diffusion layer.

公开(公告)号：US20210193894A1

公开(公告)日：2021-06-24

申请号：US17131618

申请日：2020-12-22

Applicant: SEOUL VIOSYS CO, LTD.

Inventor： Ik Kyu YOU ,  Jung Jae LEE

IPC: H01L33/62 ,  H01L25/075

Abstract: A display panel including a circuit board including first pads, first light emitting devices disposed on the circuit board and including pads, at least one second light emitting device disposed on the circuit board and including pads, metal bonding layers disposed between the pads of the first light emitting devices and the first pads on the circuit board, and a conductive material layer electrically connecting the pads of the second light emitting device to the first pads on the circuit board, in which the conductive material layer includes a conductive portion and a non-conductive portion.

公开(公告)号：US20240322072A1

公开(公告)日：2024-09-26

申请号：US18680153

申请日：2024-05-31

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Ik Kyu YOU

IPC: H01L33/00 ,  H01L25/075

CPC classification number: H01L33/0095 ,  H01L25/0753

Abstract: A transferring method for a light emitting device for a display includes manufacturing a wafer having unit pixels, cutting the wafer on a temporary substrate to singularize the unit pixels, measuring electrical or optical characteristics of the singularized unit pixels, and transferring unit pixels selected according to the electrical or optical characteristics to a carrier substrate. The selected unit pixels are transferred to the carrier substrate in a unit of a predetermined area encompassing a plurality of unit pixels.

公开(公告)号：US20240178017A1

公开(公告)日：2024-05-30

申请号：US18552143

申请日：2022-03-11

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Ik Kyu YOU ,  Jin Seok YANG

IPC: H01L21/67 ,  H01L21/66 ,  H01L25/075 ,  H01L25/13

CPC classification number: H01L21/67144 ,  H01L21/67132 ,  H01L22/20 ,  H01L25/0753 ,  H01L25/13 ,  H01L25/0756

Abstract: A transfer method of a light-emitting element for a display, according to one or more embodiments of the present disclosure, comprises: producing a wafer having unit pixels; cutting the wafer on a temporary substrate to unify the unit pixels; measuring electrical or optical characteristics of the unified unit pixels; and transferring, to a carrier substrate, the unit pixels selected according to the electrical or optical characteristics, wherein the selected unit pixels are transferred to the carrier substrate in predetermined area-units encompassing a plurality of unit pixels.

公开(公告)号：US20240088321A1

公开(公告)日：2024-03-14

申请号：US18514969

申请日：2023-11-20

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Ik Kyu YOU

IPC: H01L33/00 ,  H01L21/66 ,  H01L25/075 ,  H01L33/62

CPC classification number: H01L33/005 ,  H01L22/12 ,  H01L25/0753 ,  H01L33/62 ,  H01L2933/0066

Abstract: A flat bonding method of light emitting devices including bonding light emitting devices on a circuit board using a reflow process, and re-bonding at least a portion of the light emitting devices bonded on the circuit board using a press plate while pressing the portion of the light emitting devices.

公开(公告)号：US20210376188A1

公开(公告)日：2021-12-02

申请号：US17335900

申请日：2021-06-01

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Ik Kyu YOU

IPC: H01L33/00 ,  H01L25/075

Abstract: A transferring method for a light emitting device for a display includes manufacturing a wafer having unit pixels, cutting the wafer on a temporary substrate to singularize the unit pixels, measuring electrical or optical characteristics of the singularized unit pixels, and transferring unit pixels selected according to the electrical or optical characteristics to a carrier substrate. The selected unit pixels are transferred to the carrier substrate in a unit of a predetermined area encompassing a plurality of unit pixels.