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    Method for preparing hard flexible vinyl halide polymer-liquid polyepoxide compositions and resulting products
    11.
    发明授权
    Method for preparing hard flexible vinyl halide polymer-liquid polyepoxide compositions and resulting products 失效
    制备硬弹性乙烯基卤化物聚合物 - 液体聚环氧化物组合物和所得产物的方法

    公开(公告)号：US2795565A

    公开(公告)日：1957-06-11

    申请号：US39113353

    申请日：1953-11-09

    Applicant: SHELL DEV

    Inventor： NEWEY HERBERT A

    IPC: C08K5/1515 ,  C08L27/04 ,  C08L27/06 ,  C08L63/00 ,  C08L63/02

    CPC classification number: C08K5/1515 ,  C08K3/32 ,  C08K5/0025 ,  C08K5/55 ,  C08L27/04 ,  C08L27/06 ,  C08L57/08 ,  C08L63/00 ,  C08L2666/14 ,  C08L2666/04

    Abstract: A composition capable of being cured to form hard, flexible products comprises a vinyl halide polymer mixed with at least 20 parts of a polyepoxide per 100 parts of polymer and with a minor quantity of an epoxy curing agent. The vinyl halide polymer contains more than 50 per cent vinyl halide units and may be polyvinyl chloride or a copolymer of vinyl chloride with vinylidene chloride, methyl methacrylate, ethyl methacrylate, ethyl butyl maleate, diethyl maleate, dibutyl fumarate, allyl acetate, methallyl butyrate, acrylonitrile, methacrylonitrile, styrene, vinyl butyl ketone or vinyl ethyl ether. The polyepoxide may be monomeric or polymeric. Monomeric polyepoxides specified are vinyl cyclohexene dioxide, epoxidized soybean oil, butadiene dioxide, 1,4-bis(2,3-epoxypropoxy) benzene, diglycidyl ether, 1,2,5,6-diepoxyhexane, 1,2,3,4-tetra (2-hydroxy-3,4-epoxybutoxy) butane, an epoxy-substituted material obtained by reacting a di-isocyanate with glycidol, diglycidyl phthalate, dibutyl ester of epoxidized dimerized linoleic acid, and glycidyl polyethers of polyhydric phenols. Polymeric polyepoxides include the products obtained by reacting a polyhydric alcohol or phenol, such as glycerol, sorbitol, bis-phenol and resorcinol with a polyepoxide such as bis(2,3-epoxypropyl) ether and bis-(2,3-epoxy-2-methylpropyl) ether, the products obtained by reacting a halogen-containing epoxide with a polyhydric phenol such as resorcinol, catechol, bisphenol or bis-(2,21-dihydroxy-dinaphthyl) methane or with a polyhydric alcohol such as glycerol or ethylene glycol, poly (allyl glycidyl ether), and a copolymer of styrene and allyl glycidyl ether. The epoxy curing agent may be citric, acetic, butyric, phthalic, oxalic, succinic, maleic, fumaric, malonic, phosphoric, boric, benzenesulphonic, perchloric or persulphuric acid, acetic, phthalic, succinic, or maleic anhydride, a p-cresol, urea or diethylaniline-boron trifluoride complex, zinc, nickel, copper, iron, strontium, cadmium, selenium, magnesium, tin, cobaltous or aluminium fluoborate, potassium persulphate, potassium perchlorate, cupric, chromic, magnesium, nickel, ferrous or ferric sulphate, cupric, aluminium or nickel phosphate, cupric phosphite, chromic sulphite, lead arsenite, borate or molybdate, cadmium arsenate or silicate, silver, nickel or strontium chlorate, silver, cobaltous, copper or magnesium, fluorsilicate, ferrous silicate or manganese hypophosphite. The composition may include plasticizers such as tricresyl, trioctyl, octyl cresyl and tributoxyethyl phosphate, dibutyl, di-s-butyl, diamyl, diheptyl, di-(2-ethylhexyl), dibenzyl, dicyclohexyl and dinonyl phthalate, dibutyl and butyl phthallyl butyl glycolate, dibutyl, dibenzyl and polyethylene-glycol sebacate. The composition may be used in the production of organosols for films and coatings, when the solvent employed may be one or more of toluene, methyl isobutyl ketone, xylene, di-isobutyl ketone, dipentene and kerosene. In examples the compositions also contain dibutyl tin dilaurate.

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