公开(公告)号：US20240254278A1

公开(公告)日：2024-08-01

申请号：US18004475

申请日：2021-07-06

Applicant: DELO Industrie Klebstoffe GmbH & Co. KGaA

Inventor： Bastian SÜVEGES ,  Robert BORN

IPC: C08G59/24 ,  B29C64/40 ,  B33Y10/00 ,  B33Y70/00 ,  C08F220/06 ,  C08F220/28 ,  C08F220/54 ,  C08G2/30 ,  C08G59/42 ,  C08G59/50 ,  C08G65/18 ,  C09J5/06 ,  C09J5/08

CPC classification number: C08G59/24 ,  B29C64/40 ,  C08F220/06 ,  C08F220/282 ,  C08F220/54 ,  C08G2/30 ,  C08G59/42 ,  C08G59/50 ,  C08G65/18 ,  C09J5/06 ,  C09J5/08 ,  B33Y10/00 ,  B33Y70/00

Abstract: The invention relates to a curable composition comprising at least one curable resin component and at least one curing agent and/or one initiator for the polymerization of the curable resin compound. Moreover, the composition comprises at least one non-linear polyacetal-bridged resin component having a large number of acetal functions and functional groups of resin component (A).

公开(公告)号：US20240240012A1

公开(公告)日：2024-07-18

申请号：US18618598

申请日：2024-03-27

Applicant: Safran Cabin Inc.

Inventor： Bhaskar Biswas ,  Jack V. Lally

IPC: C08L63/04 ,  C08G59/14 ,  C08G59/22 ,  C08G59/24 ,  C08G59/38 ,  C08G59/40 ,  C08G59/42 ,  C08G59/50 ,  C08G59/62 ,  C08K3/016 ,  C08K5/00

CPC classification number: C08L63/04 ,  C08G59/1488 ,  C08G59/223 ,  C08G59/245 ,  C08G59/38 ,  C08G59/4064 ,  C08G59/42 ,  C08G59/50 ,  C08G59/621 ,  C08K3/016 ,  C08K5/0066 ,  C08L2201/02 ,  C08L2205/025

Abstract: A composition formed of an epoxy resin incorporating a fire retardant.

公开(公告)号：US20230399504A1

公开(公告)日：2023-12-14

申请号：US18043053

申请日：2021-04-16

Applicant: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION

Inventor： Yu YAMASHITA ,  Tetsuo YOSHIMITSU ,  Kotaro MURA ,  Takahiro IMAI

IPC: C08L63/00 ,  C08K5/06 ,  C08G59/42 ,  C08K3/22 ,  C08J5/24 ,  H01B3/40

CPC classification number: C08L63/00 ,  C08K5/06 ,  C08G59/42 ,  C08K3/22 ,  C08J5/249 ,  B82Y30/00 ,  C08K2201/003 ,  C08K2201/011 ,  C08L2201/56 ,  C08L2203/202 ,  C08J2363/00 ,  H01B3/40

Abstract: A resin producing method is a method of producing a resin with which an insulating structure formed on an outer peripheral portion of a conductor is impregnated. The resin producing method includes a dispersion liquid mixing step of mixing an epoxy resin and a dispersion liquid in which a nanofiller is dispersed in a reactive diluent that reduces a viscosity of the epoxy resin by reacting with the epoxy resin, and a curing agent mixing step of mixing a composition produced by the dispersion liquid mixing step, with a curing agent that cures the epoxy resin. The epoxy resin includes, for example, an alicyclic epoxy resin.

公开(公告)号：US11718706B2

公开(公告)日：2023-08-08

申请号：US16980894

申请日：2019-02-22

Applicant: Huntsman Advanced Materials Licensing (Switzerland) GmbH

Inventor： Christian Beisele ,  Hubert Wilbers ,  Daniel Baer

IPC: C08G59/22 ,  C08G59/42 ,  C08L63/00 ,  D21H17/52 ,  H01B3/52

CPC classification number: C08G59/226 ,  C08G59/42 ,  C08L63/00 ,  D21H17/52 ,  H01B3/52

Abstract: The disclosure relates to a curable mixture for use in impregnation of paper bushings comprising a resin mixture of a bisphenol-A-diglycidylether (BADGE) and a bisphenol-F-diglycidylether (BFDGE), methyltetrahydrophthalic anhydride (MTHPA) as hardener, and an accelerator selected from the group consisting of tertiary alkylamine aminoethylalcohols and corresponding ethers thereof as well as paper bushings impregnated with such mixture and uses of such mixture.

公开(公告)号：US20190214323A1

公开(公告)日：2019-07-11

申请号：US16354049

申请日：2019-03-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ya-Yu HSIEH ,  Hong-Ping LIN ,  Dao-Long CHEN ,  Ping-Feng YANG ,  Meng-Kai SHIH

IPC: H01L23/29 ,  C08G59/42 ,  C08K5/5435 ,  C08K5/544 ,  C08K3/04 ,  C08K3/36 ,  H01L23/00 ,  C09D163/00

CPC classification number: H01L23/295 ,  C08G59/42 ,  C08K3/04 ,  C08K3/36 ,  C08K5/5435 ,  C08K5/544 ,  C09D163/00 ,  H01L21/563 ,  H01L23/296 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/29393 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/01006 ,  H01L2924/05442 ,  H01L2924/0665 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A semiconductor package includes a filler composition, wherein the filler composition includes particles each including both carbon and silica, wherein the filler composition is substantially devoid of alumina or silicon carbide, and the filler composition has a weight ratio of carbon to silica of at least greater than 1.0.

公开(公告)号：US20180257182A1

公开(公告)日：2018-09-13

申请号：US15760818

申请日：2016-09-15

Applicant: Senju Metal Industry Co., Ltd.

Inventor： Yasuhiro Kajikawa ,  Yoshinori Hiraoka ,  Hiroyoshi Kawasaki ,  Takashi Hagiwara

IPC: B23K35/36 ,  C08G59/42

CPC classification number: B23K35/3613 ,  C08G59/42

Abstract: Provided is a flux, flux residue of which keeps a predetermined viscosity during reflow and after a reflow step without hindering wettability of a solder alloy, the flux being compatible with an underfill in an underfill hardening step. The flux contains a thermosetting resin, a hardening agent, an organic acid and a solvent in which the flux contains 3% or more by mass to 8% or less by mass of the resin, 1% or more by mass to 5% or less by mass of the hardening agent to remain within a limit of an additive amount of the resin, 5% or more by mass to 15% or less by mass of the organic acid and a remainder of the solvent.

公开(公告)号：US20180230261A1

公开(公告)日：2018-08-16

申请号：US15953737

申请日：2018-04-16

Applicant: KUKDO CHEMICAL CO., LTD.

Inventor： HYE SEUNG LEE ,  JAE IL KIM

IPC: C08G59/26 ,  C08G59/50 ,  C08G59/44 ,  C07D493/04

CPC classification number: C08G59/26 ,  C07D493/04 ,  C08G59/04 ,  C08G59/42 ,  C08G59/44 ,  C08G59/504

Abstract: Disclosed are a highly functional natural material-derived epoxy resin, a preparation method therefor, and an epoxy resin curing composition using the same. The highly functional natural material-derived epoxy resin represented by chemical formula 1 is obtained by reacting a compound, represented by chemical formula 2, and epichlorohydrin (ECH), which is obtained by using glycerin as a starting material, in the presence of a hydroxide salt.

公开(公告)号：US20180179328A1

公开(公告)日：2018-06-28

申请号：US15900851

申请日：2018-02-21

Applicant: Warren Environmental, Inc.

Inventor： Danny Warren

IPC: C08G59/02 ,  F16L55/164 ,  F16L57/00

CPC classification number: C08G59/02 ,  C08G59/226 ,  C08G59/42 ,  C08G59/502 ,  C08G59/621 ,  F16L55/1651 ,  F16L55/1654 ,  F16L55/1656

Abstract: A resin composition and method for installing a pipe liner that allows the liner to be fully wet out with a resin and activator and stored for a period of up to six months prior to installation and curing. A method of lining a pipe with a delayed curing resin composition is also provided that includes fully wetting out a liner with a blended two part epoxy composition such that the liner can be transported in a wet out fashion, placed in a pipe to be lined and repositioned as needed without concern for the resin composition to begin curing.

公开(公告)号：US20180118899A1

公开(公告)日：2018-05-03

申请号：US15560874

申请日：2016-03-25

Applicant: SABIC Global Technologies B.V.

Inventor： Vaidyanath RAMAKRISHNAN ,  Satish Kumar GAGGAR ,  Frederico Marques Ferreira CUSTODIO ,  Johannes Martinus Dina GOOSSENS ,  Ramon GROOTE

IPC: C08J3/24 ,  C08J3/00 ,  C08J9/00 ,  C08G59/68 ,  C08L25/12 ,  C08L27/18 ,  C08L63/00 ,  C08L67/02 ,  C07F3/06

CPC classification number: C08J3/24 ,  C07F3/06 ,  C08G59/245 ,  C08G59/42 ,  C08G59/4276 ,  C08G59/68 ,  C08G59/70 ,  C08G2270/00 ,  C08J3/005 ,  C08J9/0061 ,  C08J2463/02 ,  C08L25/12 ,  C08L27/18 ,  C08L63/00 ,  C08L67/02 ,  C08L2205/22 ,  C08L67/00 ,  C08L27/12

Abstract: Described herein are polymer compositions comprising a matrix polymer component comprising a dynamic cross-linked polymer composition; and a fibrillated fluoropolymer, a fibrillated fluoropolymer encapsulated by an encapsulating polymer, or a combination thereof. Methods of making and using these polymer compositions are also described.

公开(公告)号：US09957344B2

公开(公告)日：2018-05-01

申请号：US15495085

申请日：2017-04-24

Applicant: Henkel IP & Holding GmbH

Inventor： Ruairi O'Kane ,  Niamh Bergin ,  Brendan Kneafsey ,  David P. Birkett

IPC: C08F290/06 ,  C09J151/08 ,  C09J5/06 ,  C08G59/17 ,  C08G59/16 ,  C09J9/00

CPC classification number: C08F290/064 ,  C08F283/10 ,  C08G59/1455 ,  C08G59/1466 ,  C08G59/42 ,  C08G59/66 ,  C09J5/06 ,  C09J9/00 ,  C09J151/08 ,  C09J2451/00

Abstract: The present invention relates to novolac vinyl esters useful as thermal resistance conferring components for anaerobic curable compositions, and anaerobic curable compositions having such novolac vinyl esters. The compositions are particularly useful as adhesives and sealants.