公开(公告)号：US11358862B2

公开(公告)日：2022-06-14

申请号：US16869159

申请日：2020-05-07

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Enri Duqi ,  Lorenzo Baldo ,  Marco Del Sarto ,  Mikel Azpeitia Urquia

IPC: B81C1/00 ,  B81B3/00 ,  B81B7/00 ,  H01L29/84

Abstract: A micro-electro-mechanical device, comprising a monolithic body of semiconductor material accommodating a first buried cavity; a sensitive region facing the first buried cavity; a second cavity facing the first buried cavity; a decoupling trench extending from the monolithic body and separating the sensitive region from a peripheral portion of the monolithic body; a cap die, forming an ASIC, bonded to and facing the first face of the monolithic body; and a first gap between the cap die and the monolithic body. The device also comprises at least one spacer element between the monolithic body and the cap die; at least one stopper element between the monolithic body and the cap die; and a second gap between the stopper element and one between the monolithic body and the cap die. The second gap is smaller than the first gap.

公开(公告)号：US11309237B2

公开(公告)日：2022-04-19

申请号：US16586643

申请日：2019-09-27

Applicant: STMICROELECTRONICS S.r.l. ,  STMICROELECTRONICS (MALTA) LTD

Inventor： Marco Del Sarto ,  Alex Gritti ,  Pierpaolo Recanatini ,  Michael Borg

IPC: H01L23/498 ,  H01L23/31

Abstract: The present disclosure is directed to a semiconductor package including a substrate having a lower surface with a plurality of slot structures. The plurality of slot structures are multi-layer structures that encourage the formation of solder joints. The semiconductor package is desirable for high reliability applications in which each solder joint termination should be checked by visual systems to ensure a proper electrical connection has been made.