公开(公告)号：US11309237B2

公开(公告)日：2022-04-19

申请号：US16586643

申请日：2019-09-27

Applicant: STMICROELECTRONICS S.r.l. ,  STMICROELECTRONICS (MALTA) LTD

Inventor： Marco Del Sarto ,  Alex Gritti ,  Pierpaolo Recanatini ,  Michael Borg

IPC: H01L23/498 ,  H01L23/31

Abstract: The present disclosure is directed to a semiconductor package including a substrate having a lower surface with a plurality of slot structures. The plurality of slot structures are multi-layer structures that encourage the formation of solder joints. The semiconductor package is desirable for high reliability applications in which each solder joint termination should be checked by visual systems to ensure a proper electrical connection has been made.