Method for the surface treatment of a semiconductor substrate
    12.
    发明授权
    Method for the surface treatment of a semiconductor substrate 有权
    半导体衬底的表面处理方法

    公开(公告)号:US09321269B1

    公开(公告)日:2016-04-26

    申请号:US14836131

    申请日:2015-08-26

    Abstract: A method for application of an anti-wetting coating to a substrate of a semiconductor material is described. The method includes applying to a support a solution of a hydrocarbon comprising at least one unsaturated bond and, optionally, at least one hetero-atom for obtaining a layer of hydrocarbons. The method also includes treating at least one surface of the substrate of the semiconductor material with an acid. The layer of hydrocarbons is transferred from the support to the surface of the substrate of the semiconductor material. The layer of hydrocarbons is chemically coupled with the surface of the substrate of the semiconductor material. The method may be applied to an integrated ink jet printhead provided with a nozzle plate in which the nozzle plate serves as the substrate of the semiconductor material.

    Abstract translation: 对半导体材料的基板涂敷防湿涂层的方法进行说明。 该方法包括向载体施加包含至少一个不饱和键的烃的溶液和任选的至少一个杂原子以获得一层烃。 该方法还包括用酸处理半导体材料的衬底的至少一个表面。 烃层从载体转移到半导体材料的衬底表面。 烃层与半导体材料的衬底的表面化学偶联。 该方法可以应用于设置有喷嘴板的集成喷墨打印头,其中喷嘴板用作半导体材料的基板。

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