公开(公告)号：US20200336006A1

公开(公告)日：2020-10-22

申请号：US16849370

申请日：2020-04-15

Applicant: STMicroelectronics S.r.l.

Inventor： Roberto LA ROSA ,  Alessandro FINOCCHIARO

IPC: H02J50/00 ,  H02J7/34 ,  H02J7/00 ,  H02J50/20 ,  H02J50/40

Abstract: A first Radio-Frequency-to-Direct-Current (RF2DC) transducer receives a first signal from a sensing antenna and generates energy stored by an energy storage circuit. An energy transfer circuit is controllably switched between an energy storage state where energy is stored in the energy storage state and an energy transfer state where stored energy is transferred to a load. The voltage at the energy storage circuit is alternatively variable between an upper value and a lower value around a voltage setting point. A second RF2DC transducer, which is a down-scaled replica of the first RF2DC transducer, produces a second signal indicative of an open-circuit voltage of the first RF2DC transducer. The voltage setting point is set as a function of the second signal indicative of the open-circuit voltage of the first RF2DC transducer.

公开(公告)号：US20190266367A1

公开(公告)日：2019-08-29

申请号：US16281873

申请日：2019-02-21

Applicant: STMicroelectronics S.r.l.

Inventor： Alessandro FINOCCHIARO ,  Giovanni GIRLANDO

IPC: G06K7/10 ,  H01Q1/22

Abstract: An electromagnetic interposer circuit is attachable to an article that is also equipped with an anti-counterfeit and anti-theft/tracking electromagnetic marker. The interposer circuit includes a first interface for exchanging electrical signals with the marker at a first, shorter, communication range and a second interface coupled to the first interface for exchanging electromagnetic signals with a reader at a second, longer, communication range. The first and second interfaces exchange signals with the marker and the reader, respectively, over a radiofrequency bandwidth that includes a first frequency band and a second frequency band. A filter circuit block within the interposer circuit between the first interface and the second interface operates to block the transfer of signals between the first interface and the second interface over the first frequency band.

公开(公告)号：US20160172311A1

公开(公告)日：2016-06-16

申请号：US14565934

申请日：2014-12-10

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Alberto PAGANI ,  Giovanni GIRLANDO ,  Federico Giovanni ZIGLIOLI ,  Alessandro FINOCCHIARO

IPC: H01L23/00 ,  G01R31/28 ,  H01L23/528 ,  H01L21/768 ,  H01L21/762

CPC classification number: H01L23/562 ,  G01R31/2872 ,  H01L21/76224 ,  H01L22/14 ,  H01L23/585 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An IC may include a semiconductor substrate having circuitry formed in the substrate, an interconnect layer above the semiconductor substrate and having an antenna coupled to the circuitry, and a seal ring around a periphery of the interconnect layer. The IC may include an electrically insulating trench extending vertically into the semiconductor substrate and extending laterally across the semiconductor substrate from adjacent one side to adjacent another side.

Abstract translation: IC可以包括具有形成在衬底中的电路的半导体衬底，在半导体衬底上方的互连层，并且具有耦合到电路的天线以及围绕互连层周围的密封环。 IC可以包括垂直延伸到半导体衬底中的电绝缘沟槽，并且从相邻的一侧横向跨越半导体衬底延伸到相邻的另一侧。