公开(公告)号：US11135779B2

公开(公告)日：2021-10-05

申请号：US16886993

申请日：2020-05-29

Applicant: Samsung Display Co., Ltd.

Inventor： Hyun a Lee ,  Chan-Jae Park ,  Heeju Woo ,  Kikyung Youk ,  Sangduk Lee ,  Daehwan Jang

IPC: B29C65/00 ,  B29C65/08 ,  H05K3/30

Abstract: An ultrasonic bonding apparatus includes a stage on which a display panel is seated, a first ultrasonic generation unit which is connected to the stage and vibrates in a first direction and provide a first polarization, and a second ultrasonic generation unit in which an electronic component is seated and which vibrates in a second direction that is crossed with the first direction, and provides a second polarization, where a third polarization is provided on a plane on which the display panel contacts the electronic component.