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公开(公告)号:US11574761B2
公开(公告)日:2023-02-07
申请号:US16525729
申请日:2019-07-30
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Jae Hun Kim , Byeong Cheol Moon
Abstract: A coil electronic component includes a body having first to fourth surfaces, an insulating substrate disposed in the body, coil portions disposed on opposing surfaces of the insulating substrate, respectively, a first lead-out portion connected to one of the coil portions and exposed from the first and third surfaces, a second lead-out portion connected to another of the coil portions and exposed from the second and third surfaces, and first and second external electrodes covering the first and second lead-out portions, respectively. The insulating substrate includes a support portion supporting the coil portions, a first end portion extending from the support portion and including end surfaces respectively exposed from the first and third surfaces and spaced apart from each other, and a second end portion extending from the support portion and including end surfaces exposed from the second and third surfaces and spaced apart from each other.
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公开(公告)号:US11482370B2
公开(公告)日:2022-10-25
申请号:US16522136
申请日:2019-07-25
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Jae Hun Kim
Abstract: A coil electronic component includes a body comprising a magnetic material, an insulating substrate comprising a support portion disposed inside the body, and a tip extending from the support portion and exposed from an external surface of the body, a coil portion disposed on the support portion, and a lead-out portion extending from one end of the coil portion, disposed on the tip, and exposed from the external surface of the body. The lead-out portion has a slit exposed from the external surface of the body.
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公开(公告)号:US11437173B2
公开(公告)日:2022-09-06
申请号:US16008584
申请日:2018-06-14
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Jae Hun Kim , Seong Min Cho , Eo Jin Choi , Young Ku Lyu , Yong Hui Li
Abstract: A coil component includes a body, a coil portion embedded in the body, and external electrodes electrically connected to the coil portion. The coil portion includes coil patterns having trenches formed in surfaces thereof. The trenches extend through a partial thickness of the coil portion, and are located at aligned locations in adjacent windings of the coil portion. A method of forming the coil component includes forming a mask pattern having a coil shaped opening and including a plurality of bridges extending across the coil shaped opening in the mask pattern.
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公开(公告)号:US11348722B2
公开(公告)日:2022-05-31
申请号:US16281801
申请日:2019-02-21
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Jae Hun Kim , Jin Uk Lee
Abstract: A coil component includes a body; an internal insulating layer buried in the body; insulating walls disposed on the internal insulating layer, and including openings each having a planar coil shape having at least one turn; coil patterns including first conductive layers disposed in the openings, and second conductive layers disposed between the first conductive layers and internal surfaces of the openings, and each having a first surface in contact with the internal insulating layer and a second surface opposing the first surface; and a recessed portion formed on the second surface of each of the coil patterns and exposing at least portions of the openings of the internal walls.
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公开(公告)号:US11133125B2
公开(公告)日:2021-09-28
申请号:US16011023
申请日:2018-06-18
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Eo Jin Choi , Jae Hun Kim
Abstract: A coil component includes a body, and a coil portion embedded in the body and including a coil pattern having a plurality of coil turns and a support member supporting the coil pattern. A height of an internal coil turn of the plurality of coil turns is lower than a height of an external coil turn of the plurality of coil turns connected to the internal coil pattern and wound outwardly of the internal coil turn. A method of manufacturing the coil component includes forming a spiral-shaped plating seed pattern on a support member, forming a cutting portion cutting the spiral-shaped plating pattern, and forming a coil pattern extending across the cutting portion by performing plating on the spiral-shaped plating seed pattern.
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公开(公告)号:US10991496B2
公开(公告)日:2021-04-27
申请号:US16840734
申请日:2020-04-06
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Jae Hun Kim
Abstract: An inductor includes: a body including a coil and a magnetic material, and external electrodes disposed on an outer surface of the body. The coil is supported by a support member, and the support member may also support an insulating wall including an open-hole pattern having a shape corresponding to a pattern of the coil. An insulating ribbon formed so that a length thereof is greater than a width thereof may be additionally disposed on at least a portion of an upper surface of the insulating wall.
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公开(公告)号:US20210090784A1
公开(公告)日:2021-03-25
申请号:US16749382
申请日:2020-01-22
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Jae Hun Kim , Byeong Cheol Moon , Joung Gul Ryu
Abstract: A coil component includes a support substrate; first and second coil portions, respectively arranged on the support substrate; a body embedding the support substrate and the first and second coil portions therein; first and second lead-out portions, respectively connected to end portions of the first and second coil portions and exposed from one surface to be spaced apart from each other; and first and second connection portions, respectively connecting the end portions of the first and second coil portions to the first and second lead-out portions, wherein a line width of one end of each of the first and second connection portions connected to the respective end portion of the first and second coil portions is smaller than a line width of another end of each of the first and second connection portions connected to a respective one of the first and second lead-out portions.
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公开(公告)号:US10755847B2
公开(公告)日:2020-08-25
申请号:US15818151
申请日:2017-11-20
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Jae Hun Kim
Abstract: A coil electronic component includes a support member and a plurality of insulating patterns supported by the support member. Each of the plurality of insulating patterns includes an innermost insulating pattern adjacent to a through-hole of the support member, an outermost insulating pattern on the opposing side of the insulating patterns, and a plurality of central insulating patterns between the innermost insulating pattern and the outermost insulating pattern. At least one of the plurality of central insulating patterns has its largest width at a lower surface thereof where it is in contact with the support member.
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公开(公告)号:US10586642B2
公开(公告)日:2020-03-10
申请号:US15675942
申请日:2017-08-14
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Jae Hun Kim , Eo Jin Choi , Young Ku Lyu , Yong Hui Li
Abstract: An inductor includes a body including a coil, and a support member and external electrodes disposed on an outer surface of the body. The coil may include first and second coils, wherein the first coil does not coincide with a coil mirror-symmetric to the second coil, based on one surface of the body. This is due to the fact that exposure positions of lead portions of the first and second coils exposed to the outer surface of the body are different from each other.
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公开(公告)号:US20200027650A1
公开(公告)日:2020-01-23
申请号:US16291429
申请日:2019-03-04
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Joung Gul Ryu , Jae Hun Kim
Abstract: A coil component includes a body including a coil and an external electrode disposed on an external surface of the body to be connected to the coil. The body includes a support member, disposed to support the coil, having a via hole spaced apart from a through-hole. The coil includes a coil body and a coil lead-out portion disposed to connect the coil body and the external electrode to each other. A first support layer is disposed between one surface of the support member and one surface of the coil lead-out portion, and a second support layer is disposed on the first support layer.
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