公开(公告)号：US20190364695A1

公开(公告)日：2019-11-28

申请号：US16515275

申请日：2019-07-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Haejin LEE ,  Kyungha KOO ,  Chunghyo JUNG ,  Se-Young JANG ,  Jungje BANG ,  Jaeheung YE ,  Chi-Hyun CHO

IPC: H05K7/20 ,  F28D15/02

Abstract: An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.