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1.发明申请公开(公告)号：US20200383247A1
公开(公告)日：2020-12-03
申请号：US16766363
申请日：2018-11-19
发明人： Gyeongmin JIN , Min PARK , Jaedeok LIM , Jungje BANG , Jaeheung YE , Yongwon LEE , Seyoung JANG
摘要： The disclosure provides an electronic device having an electromagnetic shielding structure for preventing an antenna performance degradation. The disclosed electronic device may include: an antenna disposed in some areas of the electronic device; a printed circuit board; and a display module including a display panel, one or more signal lines coupled to the display panel, and a flexible substrate on which the one or more signal lines are disposed. The flexible substrate may include: a conductive layer coupled to the printed circuit board in a curved state and configured to shield an electromagnetic wave radiated from the one or more signal lines to the antenna; and a stress neutralization layer of which a material can be deformed over time in response to a shape of the flexible substrate coupled in a curved state. The stress neutralization layer may be disposed between the flexible substrate and the conductive layer.
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公开(公告)号：US20210341229A1
公开(公告)日：2021-11-04
申请号：US17375626
申请日：2021-07-14
发明人： Haejin LEE , Kyungha KOO , Chunghyo JUNG , Se-Young JANG , Jungje BANG , Jaeheung YE , Chi-Hyun CHO
摘要： An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.
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公开(公告)号：US20210055059A1
公开(公告)日：2021-02-25
申请号：US17094293
申请日：2020-11-10
发明人： Haejin LEE , Kyungha KOO , Chunghyo JUNG , Se-Young JANG , Jungje BANG , Jaeheung YE , Chi-Hyun CHO
摘要： An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.
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公开(公告)号：US20190319381A1
公开(公告)日：2019-10-17
申请号：US16384465
申请日：2019-04-15
发明人： Jungje BANG , Seungju KIM , Taewoo KIM , Bongkyu MIN , Bongchoon PARK , Jonggu PARK , Jonghan PARK , Jinyong PARK , Hoyeon SEO , Jaeheung YE , Hyelim YUN , Hyeongju LEE , Hyoungsoo JUNG
摘要： An electronic device includes a housing, a first board disposed inside the housing and including a first signal line and a first ground, a second board disposed on the first board and including a second signal line and a second ground, a plurality of connectors interposed between the first board and the second board, and a first electronic component disposed inside a space defined by the first board, the second board, and the plurality of connectors. Each of the plurality of connectors includes an insulating member, at least one conductive pin having at least a portion surrounded by the insulating member, and a metal plate electrically connecting the first ground of the first board with the second ground of the second board and formed on an outer sidewall of the insulating member. A first signal pin of conductive pins included in the plurality of connectors electrically connects the first signal line of the first board and the second signal line of the second board with the first electronic component. The first electronic component is electrically shielded against an outside of the space by the first ground of the first board, the second ground of the second board, and the metal plate.
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公开(公告)号：US20240334588A1
公开(公告)日：2024-10-03
申请号：US18739889
申请日：2024-06-11
发明人： Jichul KIM , Jaeheung YE , Kyuhwan LEE , Kwangho JUNG
CPC分类号： H05K1/0203 , H05K1/145 , H05K1/181 , H05K7/20409 , H05K2201/10159 , H05K2201/10318 , H05K2201/10568
摘要： An electronic device according to an embodiment of the disclosure may include: a first circuit board; a second circuit board with a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction and facing the first circuit board; a first electronic component disposed between the first circuit board and the second surface of the second circuit board, and disposed in a first area of the second circuit board; a second electronic component disposed in a second area of the second circuit board; a heat dissipation device comprising a thermally conductive material disposed on the first surface of the second circuit board; a first heat transfer member comprising a thermally conductive material configured to transfer heat from the first electronic component to the heat dissipation device; and a second heat transfer member comprising a thermally conductive material configured to transfer heat from the second electronic component to the first circuit board.
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6.发明公开公开(公告)号：US20240306354A1
公开(公告)日：2024-09-12
申请号：US18666570
申请日：2024-05-16
发明人： Kwangho JUNG , Yongwon LEE , Jaeheung YE , Jinhwan JEON
CPC分类号： H05K9/0024 , H05K1/0218 , H05K1/18 , H05K2201/10189 , H05K2201/10242
摘要： An electronic device according to an embodiment includes a printed circuit board including a conductive layer and a conductive pad connected to the conductive layer and exposed to an outside of the printed circuit board; an electric component disposed on a first region of the printed circuit board and the electric component electrically connected to the printed circuit board; a conductive member disposed on the conductive pad and the conductive member surrounding at least part of a periphery of the first region of the printed circuit board; and a shielding member isolating the first region of the printed circuit board from the outside of the printed circuit board by covering the electric component and the conductive member, the shielding member electrically connected to the conductive layer. In addition, various embodiments are possible.
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7.发明公开公开(公告)号：US20230156902A1
公开(公告)日：2023-05-18
申请号：US18091368
申请日：2022-12-30
发明人： Kyuhwan LEE , Min PARK , Haejin LEE , Jaeheung YE , Yeonkyung CHUNG
IPC分类号： H05K1/02
CPC分类号： H05K1/0203 , H05K2201/10378
摘要： An electronic device includes a printed circuit board (“PCB”) structure which accommodates a thermal interface material (“TIM”). The PCB structure includes a base plate, a first component on the base plate, a second component on the base plate and apart from the first component, an interposer connected to the base plate and surrounding the first component and the second component, a cover plate connected to the interposer and covering the first component and the second component, and an accommodation part which is between the base plate and a heat conduction plate and accommodates the TIM.
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公开(公告)号：US20190364695A1
公开(公告)日：2019-11-28
申请号：US16515275
申请日：2019-07-18
发明人： Haejin LEE , Kyungha KOO , Chunghyo JUNG , Se-Young JANG , Jungje BANG , Jaeheung YE , Chi-Hyun CHO
摘要： An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.
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