公开(公告)号：USD976855S1

公开(公告)日：2023-01-31

申请号：US29785795

申请日：2021-05-27

Applicant: Samsung Electronics Co., Ltd.

Designer： Jae-Wook Yoo ,  Sin-Wi Moon ,  Dae-Hun Jung ,  Byung-Min Woo ,  Dong-Wook Kim ,  Jee-Won Kim

公开(公告)号：US10454154B2

公开(公告)日：2019-10-22

申请号：US15775545

申请日：2016-11-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jung-Hwan Yeom ,  Bong-Soo Kang ,  Dae-Hun Jung

IPC: H01Q1/24 ,  H01Q9/42 ,  H01Q21/28 ,  H01Q1/38 ,  H04B1/16

Abstract: An electronic device according to various embodiments is provided and includes a conductive inner module in which a plurality of layers are stacked; an electrical opening formed in at least a portion of the rim of the conductive inner module when stacking the plurality of layers; and an antenna module disposed at the periphery of the electrical opening, wherein the antenna module may include a feeding part formed on at least one of a plurality of layers forming the conductive inner module, and a conductive pattern which is connected to the feeding part and disposed circumferencing at least one of the electrical openings.

公开(公告)号：USD710849S1

公开(公告)日：2014-08-12

申请号：US29457606

申请日：2013-06-11

Applicant: Samsung Electronics Co., Ltd.

Designer： Dae-Hun Jung

公开(公告)号：USD699232S1

公开(公告)日：2014-02-11

申请号：US29459923

申请日：2013-07-04

Applicant: Samsung Electronics Co., Ltd.

Designer： Dae-Hun Jung ,  Yong-Joo Lee