FAN-OUT SEMICONDUCTOR PACKAGE
    13.
    发明申请

    公开(公告)号:US20230052194A1

    公开(公告)日:2023-02-16

    申请号:US17884668

    申请日:2022-08-10

    Abstract: Provided is a fan-out semiconductor package including a package body having a fan-in region and a fan-out region, the fan-out region surrounding the fan-in region and including a body wiring structure; a fan-in chip structure in the fan-in region, the fan-in chip structure comprising a chip and a chip wiring structure on a top surface of the chip; a first redistribution structure on a bottom surface of the package body and a bottom surface of the fan-in chip structure, the first redistribution structure comprising first redistribution elements extending towards the fan-out region; and a second redistribution structure on a top surface of the package body and a top surface of the chip wiring structure, the second redistribution structure comprising second redistribution elements extending towards the fan-out region.

Patent Agency Ranking