公开(公告)号：US20210202414A1

公开(公告)日：2021-07-01

申请号：US16930517

申请日：2020-07-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngkyu LIM ,  Gookmi SONG ,  Sunguk LEE

IPC: H01L23/00

Abstract: A package substrate may include an insulation substrate, at least one redistribution layer (RDL) and a redistribution pad. The RDL may be included in the insulation substrate. The redistribution pad may extend from the RDL. The redistribution pad may include at least one segmenting groove in a radial direction of the redistribution pad. Thus, the at least one segmenting groove in the radial direction of the redistribution pad may reduce an area of the redistribution pad. Therefore, application of physical stress to a PID disposed over the redistribution pad may be suppressed, and thus generation of cracks in the PID may be reduced. Further, spreading of the cracks toward the redistribution pad from the PID may also be suppressed, and thus reliability the semiconductor package may be improved.

公开(公告)号：US20220406697A1

公开(公告)日：2022-12-22

申请号：US17695110

申请日：2022-03-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dahee KIM ,  Gookmi SONG

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/00 ,  H01L25/10

Abstract: A semiconductor package includes a semiconductor chip including a connecting pad, a mold layer covering the semiconductor chip, a lower redistribution layer on the semiconductor chip and the mold layer, and a connecting terminal on the lower redistribution layer. The lower redistribution layer includes a first lower insulating layer, a first conformal redistribution pattern extending through the first lower insulating layer, a second lower insulating layer on the first lower insulating layer and the first conformal redistribution pattern, and a first filled redistribution pattern disposed on the first conformal redistribution pattern and extending through the second lower insulating layer. A side surface of the first filled redistribution pattern is spaced apart from an inner side surface of the first conformal redistribution pattern. The second lower insulating layer is between the inner side surface of the first conformal redistribution pattern and the side surface of the first filled redistribution pattern.

公开(公告)号：US20220238469A1

公开(公告)日：2022-07-28

申请号：US17718639

申请日：2022-04-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngkyu LIM ,  Gookmi SONG ,  Sunguk LEE

IPC: H01L23/00

Abstract: A package substrate may include an insulation substrate, at least one redistribution layer (RDL) and a redistribution pad. The RDL may be included in the insulation substrate. The redistribution pad may extend from the RDL. The redistribution pad may include at least one segmenting groove in a radial direction of the redistribution pad. Thus, the at least one segmenting groove in the radial direction of the redistribution pad may reduce an area of the redistribution pad. Therefore, application of physical stress to a PID disposed over the redistribution pad may be suppressed, and thus generation of cracks in the PID may be reduced. Further, spreading of the cracks toward the redistribution pad from the PID may also be suppressed, and thus reliability the semiconductor package may be improved.

公开(公告)号：US20230411321A1

公开(公告)日：2023-12-21

申请号：US18459628

申请日：2023-09-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngkyu LIM ,  Gookmi SONG ,  Sunguk LEE

IPC: H01L23/00

CPC classification number: H01L24/05 ,  H01L24/20 ,  H01L2224/0401 ,  H01L2224/05011 ,  H01L2924/3512

Abstract: A package substrate may include an insulation substrate, at least one redistribution layer (RDL) and a redistribution pad. The RDL may be included in the insulation substrate. The redistribution pad may extend from the RDL. The redistribution pad may include at least one segmenting groove in a radial direction of the redistribution pad. Thus, the at least one segmenting groove in the radial direction of the redistribution pad may reduce an area of the redistribution pad. Therefore, application of physical stress to a PID disposed over the redistribution pad may be suppressed, and thus generation of cracks in the PID may be reduced. Further, spreading of the cracks toward the redistribution pad from the PID may also be suppressed, and thus reliability the semiconductor package may be improved.

公开(公告)号：US20230052194A1

公开(公告)日：2023-02-16

申请号：US17884668

申请日：2022-08-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dahee KIM ,  Gookmi SONG

IPC: H01L25/18 ,  H01L23/498 ,  H01L23/31

Abstract: Provided is a fan-out semiconductor package including a package body having a fan-in region and a fan-out region, the fan-out region surrounding the fan-in region and including a body wiring structure; a fan-in chip structure in the fan-in region, the fan-in chip structure comprising a chip and a chip wiring structure on a top surface of the chip; a first redistribution structure on a bottom surface of the package body and a bottom surface of the fan-in chip structure, the first redistribution structure comprising first redistribution elements extending towards the fan-out region; and a second redistribution structure on a top surface of the package body and a top surface of the chip wiring structure, the second redistribution structure comprising second redistribution elements extending towards the fan-out region.