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公开(公告)号：USD997161S1
公开(公告)日：2023-08-29
申请号：US29805545
申请日：2021-08-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Designer： Yusuf Cinar , Jae Hong Park , Han Hong Lee , Seon Gyun Baek , Won-Gi Hong
Abstract: FIG. 1 is a front perspective view of a solid state drive memory device showing my new design;
FIG. 2 is a front view thereof; and,
FIG. 3 is a top plan view thereof.
The evenly dashed broken lines in the figures depict portions of the solid state drive memory device that form no part of the claimed design.-
公开(公告)号：USD986900S1
公开(公告)日：2023-05-23
申请号：US29805770
申请日：2021-08-30
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Designer： Yusuf Cinar , Jae Hong Park , Han Hong Lee , Seon Gyun Baek , Won-Gi Hong
Abstract: FIG. 1 is a front perspective view of a solid state drive memory device showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left-side view thereof;
FIG. 5 is a right-side view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a bottom perspective view thereof.
The evenly dashed broken lines in the figures depict portions of the solid state drive memory device that form no part of the claimed design.-
公开(公告)号：US11495907B2
公开(公告)日：2022-11-08
申请号：US16822872
申请日：2020-03-18
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Seon Gyun Baek , Jae Hong Park , Yusuf Cinar , Han Hong Lee
IPC: H01R13/50 , H01R13/405 , H01R13/6581 , H01R13/6585 , H01R13/6583 , H01R13/6587 , H01R24/60 , H01R13/6582
Abstract: Provided are a receptacle connector configured to avoid damage to conductors of the receptacle connector. The receptacle connector includes a plurality of connection terminals, a mold structure which comprises a front part exposing each of the connection terminals and a support part disposed on a rear end of the front part and surrounding each of the connection terminals, and a shield which is disposed on the support part and comprises a conductive material, wherein the support part comprises a flat part which includes a surface along which the shield extends and a protruding part which protrudes from the surface of the flat part and is disposed in front of a front end of the shield. The protruding part is configured to avoid damage to conductors of the receptacle when a plug is mated to the receptacle.
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公开(公告)号：USD1031737S1
公开(公告)日：2024-06-18
申请号：US29837335
申请日：2022-05-04
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Designer： Yusuf Cinar , Han Hong Lee , Seon Gyun Baek
Abstract: FIG. 1 is a front perspective view of an extension kit for storage device showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left-side view thereof;
FIG. 5 is a right-side view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a rear perspective view thereof.
The evenly dashed broken lines in the figures depict portions of the extension kit for storage device that form no part of the claimed design.-
公开(公告)号：US11990701B2
公开(公告)日：2024-05-21
申请号：US17743197
申请日：2022-05-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Seon Gyun Baek , Jae Hong Park , Yusuf Cinar , Han Hong Lee
IPC: H01R13/50 , H01R13/40 , H01R13/405 , H01R13/6581 , H01R13/6585 , H01R12/51 , H01R13/502 , H01R13/504 , H01R13/6582 , H01R13/6583 , H01R13/6586 , H01R13/6587 , H01R24/60
CPC classification number: H01R13/50 , H01R13/40 , H01R13/405 , H01R13/6581 , H01R13/6585 , H01R12/51 , H01R13/502 , H01R13/504 , H01R13/6582 , H01R13/6583 , H01R13/6586 , H01R13/6587 , H01R24/60 , H01R2201/06
Abstract: Provided are a receptacle connector configured to avoid damage to conductors of the receptacle connector. The receptacle connector includes a plurality of connection terminals, a mold structure which comprises a front part exposing each of the connection terminals and a support part disposed on a rear end of the front part and surrounding each of the connection terminals, and a shield which is disposed on the support part and comprises a conductive material, wherein the support part comprises a flat part which includes a surface along which the shield extends and a protruding part which protrudes from the surface of the flat part and is disposed in front of a front end of the shield. The protruding part is configured to avoid damage to conductors of the receptacle when a plug is mated to the receptacle.
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Patent Agency Ranking
公开(公告)号：US11979996B2
公开(公告)日：2024-05-07
申请号：US17217759
申请日：2021-03-30
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Yusuf Cinar , Jae Hong Park , Han Hong Lee , Seon Gyun Baek , Won-Gi Hong
CPC classification number: H05K5/0217 , H05K5/026 , H01L25/18 , H05K1/181 , H05K2201/10159
Abstract: A memory device and an electronic device is provided. The memory device may include a memory module including a module board and a memory connector located on one side of the module board, a first enclosure placed above the memory module and a second enclosure placed below the memory module, wherein the first enclosure includes a first main cover which covers upper faces of the module board and the memory connector, at least one clamping hole which penetrates the main cover at a position overlapping the memory connector, an inter-device fastening pillar protruding downward from a lower face of the first main cover, and a coupling hole which is located inside the inter-device fastening pillar on a plane and penetrates the inter-device fastening pillar and the main cover.
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公开(公告)号：USD996424S1
公开(公告)日：2023-08-22
申请号：US29805543
申请日：2021-08-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Designer： Yusuf Cinar , Jae Hong Park , Han Hong Lee , Seon Gyun Baek , Won-Gi Hong
Abstract: FIG. 1 is a front perspective view of a solid state drive memory device showing my new design;
FIG. 2 is a front view thereof; and,
FIG. 3 is a top plan view thereof.
The evenly dashed broken lines in the figures depict portions of the solid state drive memory device that form no part of the claimed design.-
公开(公告)号：USD989767S1
公开(公告)日：2023-06-20
申请号：US29837318
申请日：2022-05-04
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Designer： Yusuf Cinar , Han Hong Lee , Seon Gyun Baek
Abstract: FIG. 1 is a front perspective view of an extension kit for storage device showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left-side view thereof;
FIG. 5 is a right-side view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a rear perspective view thereof.
The evenly dashed broken lines in the figures depict portions of the extension kit for storage device that form no part of the claimed design.-
公开(公告)号：USD986901S1
公开(公告)日：2023-05-23
申请号：US29805779
申请日：2021-08-30
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Designer： Yusuf Cinar , Jae Hong Park , Han Hong Lee , Seon Gyun Baek , Won-Gi Hong
Abstract: FIG. 1 is a front perspective view of a solid state drive memory device showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left-side view thereof;
FIG. 5 is a right-side view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof, and,
FIG. 8 is a bottom perspective view thereof.
The evenly dashed broken lines in the figures depict portions of the solid state drive memory device that form no part of the claimed design.-
公开(公告)号：USD986899S1
公开(公告)日：2023-05-23
申请号：US29805768
申请日：2021-08-30
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Designer： Yusuf Cinar , Jae Hong Park , Han Hong Lee , Seon Gyun Baek , Won-Gi Hong
Abstract: FIG. 1 is a front perspective view of a solid state drive memory device showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left-side view thereof;
FIG. 5 is a right-side view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a bottom perspective view thereof.
The evenly dashed broken lines in the figures depict portions of the solid state drive memory device that form no part of the claimed design.
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