Electronic device
    11.
    发明授权

    公开(公告)号:US11895379B2

    公开(公告)日:2024-02-06

    申请号:US17546697

    申请日:2021-12-09

    CPC classification number: H04N23/51 H04M1/0264

    Abstract: An electronic device is provided that includes a housing, a first circuit board disposed within the housing, a second circuit board spaced apart from the first circuit board, a first component and a second component disposed on at least a portion of the first circuit board or at least a portion of the second circuit board, and an interposer electrically connecting the first circuit board and the second circuit board. The interposer may be disposed between the first circuit board and the second circuit board. An arrangement space for disposing the first component and the second component may be formed between the first circuit board and the second circuit board.

    Stack structure of printed circuit boards using interposer and electronic device including the same

    公开(公告)号:US11245207B2

    公开(公告)日:2022-02-08

    申请号:US16789575

    申请日:2020-02-13

    Abstract: An electronic device is disclosed, including: a first support member including at least one screw-fastening portion; a first printed circuit board (PCB) stacked on the first support member and including at least one screw-fixing portion facing the at least one screw-fastening portion; a second PCB spaced apart from the first PCB, including a first screw guide groove; an interposer disposed between the first PCB and the second PCB electrically connecting them and including a second screw guide groove facing the first screw guide groove; and a second support member stacked on the second PCB and including a screw inlet portion facing the first screw guide groove. The second support member, the first PCB, and the first support member are fixed to each other via a screw inserted through the screw inlet portion.

    Electronic device including antenna

    公开(公告)号:US10854957B2

    公开(公告)日:2020-12-01

    申请号:US16778171

    申请日:2020-01-31

    Abstract: An electronic device in accordance with an example embodiment of the disclosure includes a first non-conductive cover defining a first surface of the electronic device, a second non-conductive cover including a first portion defining a second surface of the electronic device, and a second portion defining one portion of a lateral surface of the electronic device, a conductive frame defining an other portion of the lateral surface of the electronic device, and an antenna module, wherein the antenna module is positioned so that the one surface is substantially perpendicular to the second surface at a position within a specified proximity to the lateral surface of the electronic device and is configured to transmit and/or receive a signal through the lateral surface.

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