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公开(公告)号：US11863922B2
公开(公告)日：2024-01-02
申请号：US17971733
申请日：2022-10-24
发明人： Heecheul Moon , Sangyoup Seok , Kwonho Son , Jongchul Choi
CPC分类号： H04R1/02 , G06F1/1637 , H04N23/57 , H04R2499/11 , H04R2499/15
摘要： An electronic device is provided. The electronic device may include: a housing including a cover and at least one first opening; a first acoustic module comprising a speaker disposed in an internal space of the housing; and at least one path configured to guide sound signals generated by the first acoustic module to an outside, the at least one path including: a first space defined by the first acoustic module and at least a portion of the housing; a second space connecting the first space to the first opening and configured to guide a sound signal having a first frequency band toward the first opening; and a third space connecting the first space to a second opening at least partially provided between the housing and the cover and configured to guide a sound signal having a second frequency band lower than the first frequency band toward the second opening.
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公开(公告)号：US20220191352A1
公开(公告)日：2022-06-16
申请号：US17546697
申请日：2021-12-09
发明人： Jungsik Park , Taewoo Kim , Sangyoup Seok , Kwonho Son , Sunghyup Lee , Heeseok Jung
摘要： An electronic device is provided that includes a housing, a first circuit board disposed within the housing, a second circuit board spaced apart from the first circuit board, a first component and a second component disposed on at least a portion of the first circuit board or at least a portion of the second circuit board, and an interposer electrically connecting the first circuit board and the second circuit board. The interposer may be disposed between the first circuit board and the second circuit board. An arrangement space for disposing the first component and the second component may be formed between the first circuit board and the second circuit board.
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公开(公告)号：US12046801B2
公开(公告)日：2024-07-23
申请号：US18117521
申请日：2023-03-06
发明人： Heecheul Moon , Sangyoup Seok , Kwonho Son , Inkuk Yun , Sunghyup Lee , Heeseok Jung , Chongo Yoon , Jongchul Choi
CPC分类号： H01Q1/243 , G06F1/1637 , G06F1/1683 , H01Q1/38 , H01Q9/0407
摘要： An electronic device in accordance with an example embodiment of the disclosure includes a first non-conductive cover defining a first surface of the electronic device, a second non-conductive cover including a first portion defining a second surface of the electronic device, and a second portion defining one portion of a lateral surface of the electronic device, a conductive frame defining an other portion of the lateral surface of the electronic device, and an antenna module, wherein the antenna module is positioned so that the one surface is substantially perpendicular to the second surface at a position within a specified proximity to the lateral surface of the electronic device and is configured to transmit and/or receive a signal through the lateral surface.
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公开(公告)号：US11710890B2
公开(公告)日：2023-07-25
申请号：US17532799
申请日：2021-11-22
发明人： Heecheul Moon , Sangyoup Seok , Kwonho Son
摘要： An electronic device includes a housing that includes a front plate facing a first direction, a back plate facing a second direction opposite to the first direction, and a side member surrounding a space between the front plate and the back plate and at least a portion of which is formed of a metal material. A display is viewable through the front plate, and an antenna module is positioned in the space and includes a first surface facing a third direction different from the first direction and the second direction, a second surface facing a fourth direction different from the third direction, and at least one conductive element extended in a fifth direction, which is perpendicular to the third direction and the fourth direction and faces a first portion of the side member, adjacent to the side member, and between the first surface and the second surface.
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公开(公告)号：US11895379B2
公开(公告)日：2024-02-06
申请号：US17546697
申请日：2021-12-09
发明人： Jungsik Park , Taewoo Kim , Sangyoup Seok , Kwonho Son , Sunghyup Lee , Heeseok Jung
CPC分类号： H04N23/51 , H04M1/0264
摘要： An electronic device is provided that includes a housing, a first circuit board disposed within the housing, a second circuit board spaced apart from the first circuit board, a first component and a second component disposed on at least a portion of the first circuit board or at least a portion of the second circuit board, and an interposer electrically connecting the first circuit board and the second circuit board. The interposer may be disposed between the first circuit board and the second circuit board. An arrangement space for disposing the first component and the second component may be formed between the first circuit board and the second circuit board.
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公开(公告)号：US11837416B2
公开(公告)日：2023-12-05
申请号：US17152161
申请日：2021-01-19
发明人： Heecheul Moon , Kwonho Son , Sangyoup Seok , Byounguk Yoon
CPC分类号： H01H13/14 , G06F1/1626 , H01H13/06 , H01H13/86 , H05K5/0017 , H05K5/061 , H01H2221/08
摘要： An electronic device is provided. The electronic device includes a housing including an outer surface configured to at least partially form an external appearance of the electronic device, a button accommodation recess having a predetermined depth from the outer surface in a first direction oriented to the inner space of the electronic device, and at least one through-hole connected to the inner surface of the housing in the button accommodation recess, a key button disposed through the button accommodation recess, and including a key top inserted into the button accommodation recess and at least partially exposed to the outside, and a key base coupled to the key top, and including a protrusion facing a key flexible printed circuit board (FPCB) disposed in the inner space through the at least one through-hole. The protrusion may include an engagement portion formed at an end thereof to be larger than the protrusion.
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公开(公告)号：US11483637B2
公开(公告)日：2022-10-25
申请号：US16861703
申请日：2020-04-29
发明人： Heecheul Moon , Sangyoup Seok , Kwonho Son , Jongchul Choi
摘要： An electronic device is provided. The electronic device may include: a housing including a cover and at least one first opening; a first acoustic module comprising a speaker disposed in an internal space of the housing; and at least one path configured to guide sound signals generated by the first acoustic module to an outside, the at least one path including: a first space defined by the first acoustic module and at least a portion of the housing; a second space connecting the first space to the first opening and configured to guide a sound signal having a first frequency band toward the first opening; and a third space connecting the first space to a second opening at least partially provided between the housing and the cover and configured to guide a sound signal having a second frequency band lower than the first frequency band toward the second opening.
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公开(公告)号：US10854957B2
公开(公告)日：2020-12-01
申请号：US16778171
申请日：2020-01-31
发明人： Heecheul Moon , Sangyoup Seok , Kwonho Son , Inkuk Yun , Sunghyup Lee , Heeseok Jung , Chongo Yoon , Jongchul Choi
摘要： An electronic device in accordance with an example embodiment of the disclosure includes a first non-conductive cover defining a first surface of the electronic device, a second non-conductive cover including a first portion defining a second surface of the electronic device, and a second portion defining one portion of a lateral surface of the electronic device, a conductive frame defining an other portion of the lateral surface of the electronic device, and an antenna module, wherein the antenna module is positioned so that the one surface is substantially perpendicular to the second surface at a position within a specified proximity to the lateral surface of the electronic device and is configured to transmit and/or receive a signal through the lateral surface.
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公开(公告)号：US11940764B2
公开(公告)日：2024-03-26
申请号：US17054199
申请日：2019-04-08
发明人： Kwonho Son , Sangyoup Seok
摘要： An electronic device according to various embodiments of the present invention may comprise: a housing comprising a first plate comprising an inner surface defining a part of a space inside the housing and an outer surface forming a part of the exterior of the housing, and a side member formed integrally with the edge of the inner surface and formed substantially perpendicular to the inner surface so as to form a recess together with the inner surface, the side member comprising an opening; a speaker structure arranged adjacent to the opening inside the recess, the speaker structure comprising a first surface comprising a speaker vibration plate facing the opening, and a second surface facing away from the first surface; an engaging member mounted substantially perpendicularly to the inner surface so as to fix the speaker structure to the housing; and a fixing member fixed to the housing so as to contact at least a part of the second surface and arranged so as to pressurize the second surface. The electronic device described above may be varied according to embodiments.
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公开(公告)号：US11917347B2
公开(公告)日：2024-02-27
申请号：US17971733
申请日：2022-10-24
发明人： Heecheul Moon , Sangyoup Seok , Kwonho Son , Jongchul Choi
CPC分类号： H04R1/02 , G06F1/1637 , H04N23/57 , H04R2499/11 , H04R2499/15
摘要： An electronic device is provided. The electronic device may include: a housing including a cover and at least one first opening; a first acoustic module comprising a speaker disposed in an internal space of the housing; and at least one path configured to guide sound signals generated by the first acoustic module to an outside, the at least one path including: a first space defined by the first acoustic module and at least a portion of the housing; a second space connecting the first space to the first opening and configured to guide a sound signal having a first frequency band toward the first opening; and a third space connecting the first space to a second opening at least partially provided between the housing and the cover and configured to guide a sound signal having a second frequency band lower than the first frequency band toward the second opening.
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