公开(公告)号：US20220302722A1

公开(公告)日：2022-09-22

申请号：US17551793

申请日：2021-12-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungtae PARK ,  Minki KIM ,  Kicheol BAE ,  Yongjae SONG ,  Hyelim YUN ,  Woosung JANG

IPC: H02J7/00 ,  H01Q7/00 ,  H02J50/10 ,  H05K1/18 ,  H05K1/14 ,  H05K1/11 ,  H05K5/00

Abstract: An electronic device is provided. The electronic device includes a first circuit board, an antenna member disposed to face one surface of the first circuit board, an electronic module disposed between the first circuit board and the antenna member and including a plurality of contact protrusions disposed to face the antenna member, and a plurality of contact members disposed on the antenna member and configured to electrically contact one of the plurality of contact protrusions. As the antenna member generates an induced current in reaction to an external electrical signal or an external electromagnetic field, the electronic module may be configured to supply power using the induced current generated by the antenna member.

公开(公告)号：US20200337188A1

公开(公告)日：2020-10-22

申请号：US16921801

申请日：2020-07-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyelim YUN ,  Bongkyu MIN ,  Dohoon KIM ,  Taewoo KIM ,  Jinyong PARK ,  Jungje BANG ,  Hyeongju LEE

IPC: H05K9/00 ,  H05K1/18 ,  H05K1/11 ,  H05K7/14 ,  H05K1/14

Abstract: Disclosed is an electronic device. The electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board. The outer surface of the interposer includes a first conductive region electrically connected with at least one first through hole of the one or more through holes, and a non-conductive region, the inner surface of the interposer includes a second conductive region electrically connected with at least one second through hole of the one or more through holes, and the second conductive region includes a region facing the non-conductive region.