公开(公告)号：US20220302722A1

公开(公告)日：2022-09-22

申请号：US17551793

申请日：2021-12-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungtae PARK ,  Minki KIM ,  Kicheol BAE ,  Yongjae SONG ,  Hyelim YUN ,  Woosung JANG

IPC: H02J7/00 ,  H01Q7/00 ,  H02J50/10 ,  H05K1/18 ,  H05K1/14 ,  H05K1/11 ,  H05K5/00

Abstract: An electronic device is provided. The electronic device includes a first circuit board, an antenna member disposed to face one surface of the first circuit board, an electronic module disposed between the first circuit board and the antenna member and including a plurality of contact protrusions disposed to face the antenna member, and a plurality of contact members disposed on the antenna member and configured to electrically contact one of the plurality of contact protrusions. As the antenna member generates an induced current in reaction to an external electrical signal or an external electromagnetic field, the electronic module may be configured to supply power using the induced current generated by the antenna member.

公开(公告)号：US20220361334A1

公开(公告)日：2022-11-10

申请号：US17431900

申请日：2021-08-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taewon SUN ,  Jichul KIM ,  Kicheol BAE ,  Jinyong PARK ,  Jungje BANG ,  Yongjae SONG

IPC: H05K1/14 ,  H05K7/14 ,  H05K1/18 ,  H05K1/02 ,  H04M1/02

Abstract: An electronic device according to various embodiments may include: a display, a first circuit board disposed under the display, a first component and a second component disposed on one surface of the first circuit board, the first and second components each having different heights, a first interposer surrounding at least one side surface of the first component and disposed in a first region of the first circuit board, the first interposer part having a first height, a second interposer part surrounding at least one side surface of the second component and disposed in a second region of the first circuit board, the second interposer part having a second height different from the first height, a first second circuit board, at least a portion of which is spaced apart from the first region of the first circuit board, the first second circuit board including a first first portion bonded to the first interposer part, and a second second circuit board, at least a portion of which is spaced apart from the second region of the first circuit board, the second second circuit board including a first second portion bonded to the second interposer and spaced apart from the first second circuit board by a specified gap.

公开(公告)号：US20230085764A1

公开(公告)日：2023-03-23

申请号：US18070825

申请日：2022-11-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taeyang NA ,  Kicheol BAE ,  Chulwoo PARK

IPC: H01L23/498 ,  H01L25/16 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

Abstract: Various embodiments of the disclosure relate to an integrated circuit package, an electronic device including same, and a manufacturing method therefor, the method comprising: attaching at least one first element to a first surface of a substrate; molding the first surface using a first mold; grinding the first mold; attaching at least one second element and at least one connection member comprising a conductive material to a second surface of the substrate; and attaching an interposer substrate including landing pads for an electrical connection with a printed circuit board included in an electronic device to the second surface of the substrate.

公开(公告)号：US20150268738A1

公开(公告)日：2015-09-24

申请号：US14640313

申请日：2015-03-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyunghoon SONG ,  Jungje BANG ,  Kicheol BAE ,  Kwangsub LEE ,  Seyoung JANG

IPC: G06F3/02

CPC classification number: G06F3/0202 ,  H01H13/48 ,  H01H2215/004 ,  H01H2215/036 ,  H01H2221/05 ,  H01R13/703 ,  H01R24/62 ,  H05K1/184 ,  H05K2201/09163 ,  H05K2201/10053 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/10537

Abstract: An input device may include: (a) a connector that recognizes a connection of an external device; (b) a switch located at an upper end portion of the connector and that connects an electrical signal when a physical input of a threshold pressure or more is pressed; (c) a substrate connected to a connection terminal of the switch and mounted at a surface in which the switch is not located; and/or (d) a key base that presses the switch.

Abstract translation: 输入设备可以包括：（a）识别外部设备的连接的连接器; （b）位于所述连接器的上端部的开关，当按压阈值压力以上的物理输入时，连接电信号; （c）连接到开关的连接端子并安装在开关不位于其中的表面的基板; 和/或（d）按压开关的键座。