公开(公告)号：US20230036519A1

公开(公告)日：2023-02-02

申请号：US17679587

申请日：2022-02-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sanguk HAN ,  Jaemin Jung ,  Jeongkyu Ha ,  Kwanjai Lee

IPC: G09G3/20

Abstract: A chip on film package is provided. The chip on film package includes a film substrate with a base film, a conductive pad extending in a first direction on the base film, and a conductive line pattern extending from the conductive pad; a semiconductor chip provided on the film substrate; and a bump structure provided between the semiconductor chip and the conductive pad. A first peripheral wall and a second peripheral wall of the bump structure extend in the first direction and define a trench, a portion of the conductive pad is provided in the trench, and the conductive pad is spaced apart from at least one of the first peripheral wall and the second peripheral wall.

公开(公告)号：US20220246530A1

公开(公告)日：2022-08-04

申请号：US17579635

申请日：2022-01-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaemin Jung ,  Jeongkyu Ha ,  Sanguk Han

IPC: H01L23/538 ,  H01L25/18 ,  H05K1/18

Abstract: A chip on film (COF) package includes a base film having an upper surface and a lower surface opposite to each other, a bridge film having an edge that overlaps the base film, and an upper surface and a lower surface opposite to each other, a display driver integrated circuit (IC) mounted on the upper surface of the base film, and a heat dissipation member arranged in correspondence with the display driver IC on the lower surface of the base film. The upper surface of the base film and the lower surface of the bridge film adhere to each other in their respective long axis directions, and a long axis length of the bridge film is greater than a long axis length of the base film.