公开(公告)号：US11536766B2

公开(公告)日：2022-12-27

申请号：US16710549

申请日：2019-12-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joosung Yun ,  Soonil Kwon ,  Jihyun Choi

IPC: G01R31/28

Abstract: A test board includes a board substrate, a connector at a side of the board substrate, a plurality of device-under-test (DUT) boards which are connected to the board substrate and on which semiconductor devices are mounted as DUTs, and a plurality of DC-DC converters connected to the plurality of DUT boards. The plurality of DC-DC converters convert an input voltage supplied thereto via the connector into operating voltages, and provide the operating voltages to the semiconductor devices on the plurality of DUT boards corresponding thereto. The operating voltages are substantially the same.