公开(公告)号：US20230361453A1

公开(公告)日：2023-11-09

申请号：US18224906

申请日：2023-07-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chungsoon PARK ,  Youngjae KO ,  Kijung KIM ,  Junghyun KANG ,  Hyohoon SHIN ,  Yongsang YUN

IPC: H01Q1/27 ,  H01Q1/52

CPC classification number: H01Q1/273 ,  H01Q1/52 ,  A61B5/681

Abstract: An electronic device includes: a conductive housing; a main circuit board; and a biometric circuit board configured to measure body information, wherein the biometric circuit board may include: a first connection point at which a first conductive connection member contacts the biometric circuit board, the first conductive connection member being configured to electrically connect the conductive housing and the biometric circuit board; a second connection point at which a second conductive connection member contacts the biometric circuit board, the second conductive connection member being configured to electrically connect a biometric button and the biometric circuit board; and a third connection point at which a third conductive connection member contacts the biometric circuit board, the third conductive connection member being configured to electrically connect the main circuit board and the biometric circuit board, and the conductive housing may include a first shorting point electrically connected to the biometric circuit board and the main circuit board to provide an antenna path.

公开(公告)号：US20220330439A1

公开(公告)日：2022-10-13

申请号：US17708295

申请日：2022-03-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Taegyun KIM ,  Junghyun KANG ,  Kijung KIM ,  Shinhun MOON ,  Seunghyun CHO ,  Seongho HONG

IPC: H05K5/00 ,  H05K1/02 ,  H02J7/00 ,  H02J50/00 ,  G04G21/02 ,  G04G9/00

Abstract: An electronic device is disclosed, including a housing having a front plate, a back plate facing the front plate, and a side frame surrounding a space defined between the front and back plates, a circuit board disposed within the housing, a module assembly disposed between the circuit board and the back plate, and electrically connected with the circuit board, wherein the module assembly includes: an optical sensor module including a flexible printed circuit board (FPCB) including a first surface and a second surface facing away from the first surface, a light emitting part disposed on the first surface of the FPCB, and a light receiving part disposed on the first surface spaced apart from the light emitting part, and a wireless charging module surrounding the FPCB of the optical sensor module, and at least partially coupled to the FPCB so as to be integrated with the FPCB.