公开(公告)号：US20140137916A1

公开(公告)日：2014-05-22

申请号：US13925931

申请日：2013-06-25

Applicant: Industry-Academic Cooperation Foundation, Yonsei University ,  Samsung Electronics Co., Ltd.

Inventor： Jong-wook ROH ,  Jung-young CHO ,  Weon-ho SHIN ,  Dae-jin YANG ,  Kyu-hyoung LEE ,  Un-yong JEONG

IPC: H01L35/16 ,  G01K7/02 ,  H01L35/34

CPC classification number: H01L35/32 ,  B82Y20/00 ,  B82Y30/00 ,  G01K7/028 ,  H01L35/16 ,  H01L35/34

Abstract: A thermoelectric material including a 3-dimensional nanostructure, wherein the 3-dimensional nanostructure includes a 2-dimensional nanostructure connected to a 1-dimensional nanostructure.

Abstract translation: 包括三维纳米结构的热电材料，其中所述三维纳米结构包括连接到一维纳米结构的二维纳米结构。

公开(公告)号：US20140109948A1

公开(公告)日：2014-04-24

申请号：US13904365

申请日：2013-05-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyu-hyoung LEE ,  Sang-il KIM ,  Se-yun KIM ,  Eun-sung LEE

IPC: H01L35/08 ,  H01L35/34

CPC classification number: H01L35/08 ,  H01L35/18 ,  H01L35/34

Abstract: A thermoelectric module including: an n-type thermoelectric element; a p-type thermoelectric element; a diffusion blocking layer bonded integrally on each of a top and a bottom surface of the n-type thermoelectric element and on each of a top and a bottom surface of the p-type thermoelectric element; an electrode on the n-type thermoelectric element and on the p-type thermoelectric element; and a bonding layer disposed between the electrode and at least one of the n-type thermoelectric element and the p-type thermoelectric element, wherein the bonding layer includes an amorphous metal.

Abstract translation: 一种热电模块，包括：n型热电元件; p型热电元件; 在n型热电元件的顶表面和底表面之间以及p型热电元件的顶表面和底表面中的每一个上均匀地结合的扩散阻挡层; n型热电元件上的电极和p型热电元件上的电极; 以及配置在电极与n型热电元件和p型热电元件中的至少一个之间的接合层，其中，接合层包括非晶态金属。