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公开(公告)号：US10420235B2
公开(公告)日：2019-09-17
申请号：US15184292
申请日：2016-06-16
发明人： Sung-Won Park , Seungyup Lee , Sangil Lee , Won-Jea Jang
IPC分类号： H05K5/02 , H01G2/10 , H01G4/01 , H01G4/224 , H01G4/228 , H01M10/42 , G06F1/16 , H04B1/3888 , H04M1/02 , H04M1/18 , H05K5/00 , H05K5/04 , H01M16/00
摘要： An electronic device is provided. The electronic device includes a first metal plate of a metal bezel that forms the external appearance of the electronic device, a second metal plate that overlaps the first metal plate while being spaced apart from the first metal plate, a dielectric member interposed between the first metal plate and the second metal plate, and a substrate electrically connected to a contact terminal of the second metal plate to feed power. Other embodiments are possible.
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公开(公告)号：US10111321B2
公开(公告)日：2018-10-23
申请号：US15045480
申请日：2016-02-17
发明人： Sung-Won Park , Dong-Kyun Yu , Ji-Heon Yu , Seung-Yup Lee , Taek-Kyun Choi
摘要： Various embodiments related to a printed circuit board in which a capacitor is embedded are described. The capacitor may include: a plurality of first conductive layers that have a plurality of first via holes; a plurality of second conductive layers that have a plurality of second via holes, wherein the first and second conductive layers are alternately arranged in turns; and a plurality of dielectric layers that are arranged between the first and second conductive layers. Other various embodiments are possible.
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