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公开(公告)号：US10111321B2
公开(公告)日：2018-10-23
申请号：US15045480
申请日：2016-02-17
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sung-Won Park , Dong-Kyun Yu , Ji-Heon Yu , Seung-Yup Lee , Taek-Kyun Choi
Abstract: Various embodiments related to a printed circuit board in which a capacitor is embedded are described. The capacitor may include: a plurality of first conductive layers that have a plurality of first via holes; a plurality of second conductive layers that have a plurality of second via holes, wherein the first and second conductive layers are alternately arranged in turns; and a plurality of dielectric layers that are arranged between the first and second conductive layers. Other various embodiments are possible.
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