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11.发明申请TRANSDUCER MODULE INCLUDING CURVED SURFACE FRAME, ULTRASONIC PROBE INCLUDING TRANSDUCER MODULE, AND METHOD OF PRODUCING CURVED SURFACE FRAME 审中-公开包括弯曲表面框架的传感器模块，包括传感器模块的超声波探头和产生弯曲表面框架的方法公开(公告)号：US20140013850A1
公开(公告)日：2014-01-16
申请号：US13940422
申请日：2013-07-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Young Il KIM , Bae Hyung KIM , Jong Keun SONG , Seung Heun LEE , Kyung Il CHO
IPC: G01N29/26
CPC classification number: G01N29/26 , B06B1/0622 , G01N29/2406 , G01N29/2456 , G01N29/28 , G01N2291/106 , G01N2291/2636 , G01N2291/2638 , G01S15/892
Abstract: A transducer module includes a curved surface frame which is formed from a flexible material in a curved shape and includes a front surface and a rear surface; a transducer which is disposed on the front surface; and a support frame which is mounted on the rear surface and supports the curved surface frame.
Abstract translation: 传感器模块包括由弯曲形状的柔性材料形成并包括前表面和后表面的曲面框架; 设置在前表面上的换能器; 以及安装在后表面上并支撑曲面框架的支撑框架。
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