公开(公告)号：US20140013850A1

公开(公告)日：2014-01-16

申请号：US13940422

申请日：2013-07-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Young Il KIM ,  Bae Hyung KIM ,  Jong Keun SONG ,  Seung Heun LEE ,  Kyung Il CHO

IPC: G01N29/26

CPC classification number: G01N29/26 ,  B06B1/0622 ,  G01N29/2406 ,  G01N29/2456 ,  G01N29/28 ,  G01N2291/106 ,  G01N2291/2636 ,  G01N2291/2638 ,  G01S15/892

Abstract: A transducer module includes a curved surface frame which is formed from a flexible material in a curved shape and includes a front surface and a rear surface; a transducer which is disposed on the front surface; and a support frame which is mounted on the rear surface and supports the curved surface frame.

Abstract translation: 传感器模块包括由弯曲形状的柔性材料形成并包括前表面和后表面的曲面框架; 设置在前表面上的换能器; 以及安装在后表面上并支撑曲面框架的支撑框架。

公开(公告)号：US20140360274A1

公开(公告)日：2014-12-11

申请号：US14301751

申请日：2014-06-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyung Il CHO ,  Bae Hyung KIM ,  Young Il KIM ,  Jong Keun SONG ,  Seung Heun LEE

IPC: G01N29/24

CPC classification number: A61B8/4427 ,  A61B8/4444 ,  A61B8/546 ,  G01N29/0654 ,  G01N29/2431

Abstract: A portable ultrasonic probe includes a main body including a transducer to generate an ultrasonic wave and a folder portion including a display portion and pivotally coupled to an end portion of the main body, the main body includes a first heat radiation module configured to absorb and emit heat generated by the transducer, and the folder portion includes a second heat radiation module thermally coupled to the first heat radiation module when the folder portion is in a first position and configured to emit heat transmitted from the first heat radiation module.

Abstract translation: 便携式超声波探头包括：主体，其包括用于产生超声波的换能器和包括显示部分并且可枢转地联接到主体的端部的折叠部分，主体包括被配置为吸收和发射的第一散热模块 由换能器产生的热量，并且折叠部分包括第二散热模块，当第二散热模块处于第一位置并被配置为发射从第一散热模块传输的热量时，第二散热模块热耦合到第一散热模块。

公开(公告)号：US20130286593A1

公开(公告)日：2013-10-31

申请号：US13873342

申请日：2013-04-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyung Il CHO ,  Seung Heun LEE ,  Bae Hyung KIM ,  Young Il KIM ,  Jong Keun SONG

IPC: H05K7/20

CPC classification number: H05K7/20336 ,  B06B1/0292 ,  G01N29/2406 ,  G01N29/326 ,  H05K1/0204 ,  H05K2201/064 ,  H05K2201/09072 ,  H05K2201/10598

Abstract: An ultrasonic probe, from which heat generated in an integrated circuit which is bonded to a cMUT is released, is provided. The ultrasonic probe includes a transducer which is configured to generate ultrasound radiation, an integrated circuit which is installed on the rear surface of the transducer, a printed circuit board which is installed on the rear surface of the integrated circuit and has an opening via which the rear surface of the integrated circuit is at least partially exposed, a heat spreader which has a protrusion inserted into the opening of the printed circuit board and is configured to absorb heat generated in the integrated circuit, and a heat dissipation module which is configured to release heat absorbed by the heat spreader to the outside.

Abstract translation: 提供了一种超声波探头，其中释放了结合到cMUT的集成电路中产生的热量。 超声波探头包括被配置为产生超声波的换能器，安装在换能器的后表面上的集成电路，安装在集成电路的后表面上的印刷电路板，并且具有开口， 集成电路的后表面至少部分地露出，散热器具有插入印刷电路板的开口中的突起，并且被构造成吸收集成电路中产生的热量，散热模块被配置为释放 散热器吸收的热量到外面。

公开(公告)号：US20150140824A1

公开(公告)日：2015-05-21

申请号：US14607265

申请日：2015-01-28

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  Kyungpook National University Industry-Academic Cooperation Foundation

Inventor： Young Il KIM ,  Bae Hyung KIM ,  Jong Keun SONG ,  Seung Heun LEE ,  Kyung Il CHO ,  Yong Rae ROH ,  Won Seok LEE

IPC: H01L21/3065 ,  H01L21/308

CPC classification number: H01L21/3065 ,  A61B8/4411 ,  B06B1/0292 ,  H01L21/308 ,  H01L22/12 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/131 ,  H01L2224/16238 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/7598 ,  H01L2224/75983 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2924/1461 ,  Y10T156/1702 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00

Abstract: A jig includes a wafer including an accommodation groove configured to accommodate a capacitive micromachined ultrasonic transducer (cMUT) when flip chip bonding is performed, and a separation groove formed in a bottom surface of the accommodation groove, the separation groove having a bottom surface that is spaced apart from thin films of the cMUT that face the bottom surface of the separation groove when the cMUT is seated on portions of the bottom surface of the accommodation groove.

Abstract translation: 夹具包括晶片，其包括配置为在进行倒装芯片接合时容纳电容微机械超声换能器（cMUT）的容纳凹槽和形成在容纳槽的底表面中的分离槽，分离槽具有底表面， 当cMUT位于容纳槽的底部表面的部分上时，与位于分离槽的底表面的cMUT的薄膜间隔开。

公开(公告)号：US20140364742A1

公开(公告)日：2014-12-11

申请号：US14301741

申请日：2014-06-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyung Il CHO ,  Bae Hyung KIM ,  Young Il KIM ,  Jong Keun SONG ,  Seung Heun LEE

IPC: H05K7/20 ,  A61B8/00

CPC classification number: A61B8/4444 ,  A61B8/546 ,  H05K7/20445 ,  Y10T29/49005

Abstract: Disclosed herein is an ultrasonic probe capable of emitting heat generated by a transducer outside the ultrasonic probe using a heat radiation plate. The ultrasonic probe includes a transducer configured to generate an ultrasonic wave, a heat spreader provided on a surface of the transducer, the heat spreader being configured to absorb heat generated by the transducer, at least one heat radiation plate which contacts at least one side of the heat spreader, and at least one board installed on the at least one heat radiation plate so as to transfer heat generated by the at least one board to the at least one heat radiation plate.

Abstract translation: 这里公开了一种能够使用散热板在超声波探头外部发射由换能器产生的热量的超声波探头。 所述超声波探头包括构造成产生超声波的换能器，设置在所述换能器的表面上的散热器，所述散热器被配置为吸收由所述换能器产生的热量;至少一个热辐射板，其接触所述换能器的至少一侧 散热器和安装在至少一个散热板上的至少一个板，以将由至少一个板产生的热量传递到至少一个散热板。

公开(公告)号：US20150099977A1

公开(公告)日：2015-04-09

申请号：US14509431

申请日：2014-10-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Bae Hyung KIM ,  Young Il KIM ,  Jong Keun SONG ,  Seung Heun LEE ,  Kyung Il CHO

IPC: A61B8/08 ,  A61B8/14 ,  A61B8/00

CPC classification number: A61B8/5207 ,  A61B8/14 ,  A61B8/4461 ,  A61B8/54 ,  G01S7/5202 ,  G01S7/52025 ,  G01S15/8915 ,  G01S15/8925 ,  G01S15/8927 ,  G10K11/346

Abstract: Disclosed herein is a beamforming apparatus for beamforming signals which are transmitted or received by a probe which includes a plurality of transducer blocks, each of which includes a plurality of transducers. The apparatus includes a controller configured to control components to delay signals to be transmitted by the plurality of transducers included in each transducer block or signals received by the plurality of transducers included in each transducer block, and an analog beamformer which includes a plurality of beamforming units which correspond to the respective transducer blocks. The plurality of beamforming units is configured to perform analog beamforming on signals transmitted or received by the plurality of transducers included in each transducer block based on a control signal which is received from the controller, to reduce a dynamic delay range, thereby reducing a size of a delay line.

Abstract translation: 本文公开了一种用于波束成形信号的波束成形装置，其由探头发送或接收，该探针包括多个换能器块，每个换能器块包括多个换能器。 该装置包括：控制器，被配置为控制部件以延迟由每个换能器块中包括的多个换能器传输的信号或由包括在每个换能器块中的多个换能器接收的信号;以及模拟波束形成器，其包括多个波束形成单元 其对应于相应的换能器块。 多个波束形成单元被配置为基于从控制器接收到的控制信号对包含在每个换能器块中的多个换能器发送或接收的信号执行模拟波束形成，以减小动态延迟范围，从而减小 延迟线。

公开(公告)号：US20140364741A1

公开(公告)日：2014-12-11

申请号：US14301540

申请日：2014-06-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyung Il CHO ,  Jong Keun SONG ,  Bae Hyung KIM ,  Young Il KIM ,  Seung Heun LEE

IPC: A61B8/00

CPC classification number: A61B8/4427

Abstract: Provided is a portable ultrasonic probe including a main body comprising a transducer configured to generate an ultrasonic wave, and a folder part comprising a display and rotatably coupled to an end portion of the main body, wherein the main body further comprises an analog to digital (AD) converter and a beamformer, the AD converter and the beamformer being provided in a chip.

Abstract translation: 提供了一种便携式超声波探头，其包括主体，其包括构造成产生超声波的换能器，以及包括显示器的折叠部分，其可旋转地联接到主体的端部，其中主体还包括模数（ AD）转换器和波束形成器，AD转换器和波束形成器设置在芯片中。

公开(公告)号：US20130341303A1

公开(公告)日：2013-12-26

申请号：US13926278

申请日：2013-06-25

Applicant: Kyungpook National University Industry-Academic Cooperation Foundation ,  SAMSUNG ELECTRONICS CO., LTD.

Inventor： Young Il KIM ,  Bae Hyung KIM ,  Jong Keun SONG ,  Seung Heun LEE ,  Kyung Il CHO ,  Yong Rae ROH ,  Won Seok LEE

IPC: A61B8/00

CPC classification number: H01L21/3065 ,  A61B8/4411 ,  B06B1/0292 ,  H01L21/308 ,  H01L22/12 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/131 ,  H01L2224/16238 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/7598 ,  H01L2224/75983 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2924/1461 ,  Y10T156/1702 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00

Abstract: A jig includes a wafer including an accommodation groove configured to accommodate a capacitive micromachined ultrasonic transducer (cMUT) when flip chip bonding is performed, and a separation groove formed in a bottom surface of the accommodation groove, the separation groove having a bottom surface that is spaced apart from thin films of the cMUT that face the bottom surface of the separation groove when the cMUT is seated on portions of the bottom surface of the accommodation groove.

公开(公告)号：US20130242705A1

公开(公告)日：2013-09-19

申请号：US13741907

申请日：2013-01-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Young-Il KIM ,  Dong Wook KIM ,  Bae Hyung KIM ,  Jong Keun SONG ,  Seung Heun LEE ,  Kyung II CHO

IPC: H04R1/00 ,  H04R31/00

CPC classification number: H04R1/00 ,  B06B1/0292 ,  G10K11/004 ,  H04R31/00 ,  Y10T29/49005

Abstract: A multi-array type ultrasonic probe apparatus includes n tiles which transmit and receive an ultrasonic beam; and a substrate having n guide portions on which the n tiles are mounted, respectively, to be aligned in a multi-array. The multi-array ultrasonic probe apparatus may align tiles in identical directions and at identical levels to control a direction and a time for transmitting and receiving an ultrasonic beam to be transmitted and received at the tiles, thereby providing a stable ultrasonic beam.

Abstract translation: 多阵列型超声波探头装置包括发射和接收超声波束的n个瓦片; 以及分别安装有n个瓦片的n个引导部分的基板，以被排列成多阵列。 多阵列超声波探头装置可以在相同的方向和相同的水平上对齐瓦片，以控制发送和接收要在瓦片处发送和接收的超声波束的方向和时间，从而提供稳定的超声波束。